Resources Contact Us Home Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE     Daniel G. Parker Patents Inventor: Parker; Daniel G. Address: Palo Alto, CA No. of patents: 1 Patents: Patent Number Title Of Patent Date Issued 6830990 Method and apparatus for dicing released MEMS wafers December 14, 2004 Various embodiments are methods and apparatuses for different steps in separating wafers into multiple wafer die. Some embodiments are adapted for dicing wafers having a front side and a back side, where the front side has processed devices, such as MEMS devices.       Recently Added Patents Business message tracking system using message queues and tracking queue for tracking transaction messages communicated between computers Data system having a virtual queue Collapsible-type lens barrel and image sensing apparatus with withdrawing blur correction lenses Optical circuit board, an optical backplane and an optical communication system System and method for providing automated database assistance to financial service operators Measuring medium activity patterns in wireless networks and deriving information from the activity patterns Systems and methods for electronic postmarking including ancillary data background   Randomly Featured Patents Optical fibers, devices and methods for making same Catalytic production of light olefins from naphtha feed Reciprocating piston fluid pump Vehicle running board Aryl ethynyl phthalic anhydrides and polymers with terminal or pendant amines prepared with aryl ethynyl phthalic anhydrides Method of making 2,7-dimethyl-2,4,6-octatrienedial and derivatives thereof Valving system for hurricane plugs Preset apparatus of electronic musical instrument Catheterization set Food processor © 2006. PatentGenius. All Rights Reserved.