| Patent Number |
Title Of Patent |
Date Issued |
| 7091019 |
Farnesyl pyrophosphate synthase proteins, nucleic acids and promoter regions therefor |
August 15, 2006 |
| A nucleotide sequence and protein of the hop farnesyl pyrophosphate synthase is described herein. |
| 7060815 |
Isolated and purified nucleic acids comprising a gene and a regulatory region for the gene expre |
June 13, 2006 |
| An isolated and purified nucleic acid comprising a gene specifically expressed in hop lupulin glands. Hops are dioecious, and only female plants bear cones, the lupulin glands of which contain secondary metabolic products which provide bitterness and flavor to beer. These secondary m |
| 6988070 |
Voice control system for operating home electrical appliances |
January 17, 2006 |
| A voice control system for managing home electrical appliances includes a home agent server (HAS) connected to the home electrical appliances, a microphone and a speaker linked to the agent server through an in-house network. An transaction processing (TP) program runs on HAS and int |
| 6967401 |
Semiconductor device, semiconductor module and hard disk |
November 22, 2005 |
| A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a first supporting member (11) are substantially wi |
| 6963126 |
Semiconductor device with under-fill material below a surface of a semiconductor chip |
November 8, 2005 |
| AS conductive patterns 11A to 11D are formed burying in a insulating resin 10 and a conductive foil 20 is formed being half-etched, thickness of the device is made thin. As an electrode for radiation 11D is provided, a semiconductor device superior in radiation is provided. |
| 6933604 |
Semiconductor device, semiconductor module and hard disk |
August 23, 2005 |
| The back surface of a semiconductor chip (16) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this semiconductor chip (16). The back surface of this metal plate (23) and the back surface of a first supporting member (11) are substantiall |
| 6933374 |
Farnesyl pyrophosphate synthase protein, nucleic acid and promoter region thereof |
August 23, 2005 |
| The promoter region of the farnesyl pyrophosphate synthase gene that was expressed in the hop luplin gland in a specific manner was elucidated based on the genomic DNA of the hop farnesyl pyrophosphate synthase gene having the nucleotide sequence set forth in SEQ ID NO:2, the cDNA of the |
| 6909178 |
Semiconductor device and method of manufacturing the same |
June 21, 2005 |
| As conductive patterns 11A to 11D are formed burying in a insulating resin 10 and a conductive foil 20 is formed being half-etched, thickness of the device is made thin. As an electrode for radiation 11D is provided, a semiconductor device superior in radiation is provided. |
| 6894375 |
Semiconductor device, semiconductor module and hard disk |
May 17, 2005 |
| A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a flexible sheet become substantially within a same |
| 6864121 |
Method of manufacturing circuit device |
March 8, 2005 |
| A conductive pattern of a first layer isolated by an isolation trench is formed on a conductive foil, and a plurality of layers of the conductive patterns are formed thereon to create a multilayered wiring structure, and furthermore, a circuit element is mounted and molded with an insula |
| 6812410 |
Semiconductor module and method of manufacturing the same |
November 2, 2004 |
| A first metal film 14 made of a Cu plated film is formed on a radiation substrate 13A made of Al, and an island 15 exposed from a back surface of a semiconductor device 10 is adhered thereto. At that time, the back surface of the semiconductor device 10 is brought into contact with c |
| 6791199 |
Heat radiating semiconductor device |
September 14, 2004 |
| AS conductive patterns 11A to 11D are formed burying in a insulating resin 10 and a conductive foil 20 is formed being half-etched, thickness of the device is made thin. As an electrode for radiation 11D is provided, a semiconductor device superior in radiation is provided. Thickness of |
| 6750257 |
Colloidal silica slurry |
June 15, 2004 |
| The present invention provides the colloidal silica slurry which does not have a bad influence, such as corrosion, to a silicon wafer and wiring material on a silicon wafer and inhibits growth of microbes, and whereof preserving stability is high because stability of particle diameters o |
| 6706547 |
Method of manufacturing a circuit device with trenches in a conductive foil |
March 16, 2004 |
| After conductive patterns are formed on the conductive foil every block by employing isolation trenches, conductive plating layers are arranged selectively on the conductive patterns. Therefore, it is possible to accomplish the circuit device manufacturing method by which the die bon |
| 6646331 |
Semiconductor device and semiconductor module |
November 11, 2003 |
| A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a flexible sheet become substantially within a same |
| 6639127 |
Isolated and purified hop lupulin gland-specific promoter |
October 28, 2003 |
| An isolated and purified nucleic acid comprising a gene specifically expressed in hop lupulin glands. Hops are dioecious, and only female plants bear cones, the lupulin glands of which contain secondary metabolic products which provide bitterness and flavor to beer. These secondary m |
| 6635956 |
Semiconductor device, semiconductor module and hard disk |
October 21, 2003 |
| A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to the heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a first supporting member (11) are substantially wit |
| 6596564 |
Semiconductor device and method of manufacturing the same |
July 22, 2003 |
| AS conductive patterns 11A to 11D are formed burying in a insulating resin 10 and a conductive foil 20 is formed being half-etched, thickness of the device is made thin. As an electrode for radiation 11D is provided, a semiconductor device superior in radiation is provided. |
| 6583719 |
Setting apparatus and setting method each for setting setting information in electric power line |
June 24, 2003 |
| A setting apparatus and a setting method are provided for setting setting information including attribute information and interlocking operation information into an electric power line carrier communication terminal apparatus equipped with an electric power line carrier communication |
| 6531370 |
Method for manufacturing circuit devices |
March 11, 2003 |
| After mounting portions (65) are formed in each block (62), circuit elements are mounted on the mounting portions (65) and molded with insulating resin (50). Then, the back surface of conductive foil (60) is etched to form conductive patterns 51in each block. Further, a plurality of |
| 6501162 |
Semiconductor device, semiconductor module and hard disk |
December 31, 2002 |
| A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to the heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a first supporting member (11) are substantially wit |
| 6462418 |
Semiconductor device having improved heat radiation |
October 8, 2002 |
| As conductive patterns 11A to 11D are formed burying in a insulating resin 10 and a conductive foil 20 is formed being half-etched, thickness of the device is made thin. As an electrode for radiation 11D is provided, a semiconductor device superior in radiation is provided. |
| 6265633 |
Isolated and purified nucleic acids comprising a gene and a regulatory region for the gene expre |
July 24, 2001 |
| An isolated and purified nucleic acid comprising a gene specifically expressed in hop lupulin glands. Hops are dioecious, and only female plants bear cones, the lupulin glands of which contain secondary metabolic products which provide bitterness and flavor to beer. These secondary m |
| 5999342 |
Objective lens driving system and manufacturing method for same |
December 7, 1999 |
| An objective lens driving system comprises a lens holder retaining an objective lens, a holder supporting member for movably supporting the lens holder in focusing and tracking directions, a magnetic driving circuit for moving the lens holder in the focusing and tracking directions, in w |
| 5952489 |
Tissue-specific promoter |
September 14, 1999 |
| The invention provides a promoter capable of expressing an introduced gene in plant seeds, a vector comprising said promoter, a method for producing transgenic plants through transformation of plants with said vector, and a transgenic plant as transformed with said vector.After a suitabl |
| 5863784 |
Recombinant .beta.-amylase |
January 26, 1999 |
| A recombinant .beta.-amylase which is superior to the original recombinant .beta.-amylase in thermostability has been obtained by a site-directed mutagenesis with the recombinant .beta.-amylase gene coding 531 amino acid residues. Substitutions were MET.sub.181 of said enzyme with Leu, |
| 5726057 |
Barley .beta. amylase structural gene |
March 10, 1998 |
| The present invention provides a barley .beta.-amylase structural gene consisting of the nucleotide sequence shown in SEQ. ID. No. 1 in attached sequence listing, a barley .beta.-amylase structural gene consisting of the nucleotide sequence shown in SEQ. ID. No. 2 in attached sequence |
| 5688684 |
Recombinant .beta.-amylase |
November 18, 1997 |
| A recombinant .beta.-amylase which is superior to the original recombinant .beta.-amylase in thermostability has been obtained by a site-directed mutagenesis with the recombinant .beta.-amylase gene coding 531 amino acid residues. Substitutions were MET.sub.181 of said enzyme with Leu, |
| 4975607 |
Frequency generator with superimposed generation coil |
December 4, 1990 |
| A frequency generator includes a circuit board having one surface on which a generating coil pattern and a wiring pattern are printed in stacked relationship via an insulating layer. In a preferred embodiment, the coil is pointed over the wiring pattern. |
| 4961377 |
Thermal stencil master sheet and adhesive therefor |
October 9, 1990 |
| A thermal stencil master sheet for stencil printing has a thermoplastic synthetic resin film which is perforatable with heat and a porous substrate, which is substantially unchanged by the heat. The film is bonded to the substrate with a urethane adhesive, preferably composed mainly |
| 4795666 |
Fiber reinforced structural member |
January 3, 1989 |
| A fiber reinforced structural member comprises a shell element formed of a fiber reinforced material such as, for example, a fiber reinforced plastic, and a core element having a large joining surface fixedly joined to the inner surface of the shell element, and comprising one or a p |
| 4737536 |
Automobile bumper formed of thermoplastic multicomponent resin |
April 12, 1988 |
| Disclosed is an automobile bumper which is formed of a thermoplastic multicomponent resin composition and which is improved in weatherability and impact resistance at low temperatures and also in surface glossiness. Essentially the resin composition is a blend of 22-28 wt % of a hydr |
| 4569880 |
Reinforcing adhesive sheet |
February 11, 1986 |
| A reinforcing adhesive sheet comprising: a thermosetting reinforcing resin sheet containing a reinforcing material in an unhardened or semi-hardened state; and a bead-forming material provided on the thermosetting reinforcing resin sheet, the bead-forming material being narrower than the |
| 4564557 |
Thermoset acrylic resin composition for coating metallic materials and stainless steel coated wi |
January 14, 1986 |
| A thermoset acrylic resin composition for coating metallic materials, particularly stainless steel, having a superior adhesion thereonto and hence a superior resistance to forming after coated, and a stainless steel piece coated with a coating material comprising the above composition, |
| 4505457 |
Railway truck spring height adjustment device |
March 19, 1985 |
| A height adjusting device for the truck of a railroad vehicle including spring retainer supporting members consisting of a plurality of concentric segments which are arranged around the axis of a spring retainer in symmetry with respect to the axis. Each segment has an upper surface whic |
| 4504534 |
Core material for automobile bumpers |
March 12, 1985 |
| A core material for automobile bumpers which is composed of a molded article of foamed particles of a polypropylene-type resin. The molded article has a density of 0.015 to 0.045 g/cm.sup.3 and a compression stress at 50% compression of at least 1 kg/cm.sup.2. The core material simul |
| 4451518 |
Reinforcing member |
May 29, 1984 |
| A reinforcing member includes a reinforcing resin layer which is elastic in its semi-hardened or unhardened state before the reinforcing member is applied to an object to be reinforced and which is rigid in its hardened state; an expandable member centered along the reinforcing resin lay |
| 4399174 |
Reinforcing material |
August 16, 1983 |
| A material for reinforcing a panel comprises a strip of expandable material which has not yet expanded, and a sheet of resin material which has not yet hardened. The expandable material is centered onto a central portion of the resin material so that the edges of the resin material are e |
| 4397914 |
Reinforcing material for a panel |
August 9, 1983 |
| A material for reinforcing a panel includes a resin material and a expandable material. The expandable material is centered onto the resin material in such a manner that the edges of the resin material are exposed and can adhere to the panel. The expandable material includes an easy- |
| 4378395 |
Reinforcing material |
March 29, 1983 |
| A material for reinforcing a panel or plate includes a first resin layer having a high tensile modulus of elasticity after hardening; a second resin layer having a low tensile modulus of elasticity after hardening; an expandable member disposed between the second resin layer side and the |
| 4378394 |
Reinforcing member |
March 29, 1983 |
| A reinforcing material, comprises a reinforcing resin sheet which is unhardened or semi-hardened to be flexible prior to its use; a high tensile-strength fiber for reinforcing the resin sheet in its longitudinal direction; a low tensile-strength fiber for reinforcing the resin sheet in |
| 4369608 |
Panel for automobile |
January 25, 1983 |
| A panel for an automotive vehicle and the method of making same. A main reinforcing member is bonded to an outer panel, the reinforcing member being made of a hardened thermosetting material. An auxiliary reinforcing member is attached to and covers the entire inner side of the main |
