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Kazushige Obayashi Patents |
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Inventor: Obayashi; Kazushige
Address: Nagoya, JP
No. of patents: 6
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 6876091 |
Wiring board |
April 5, 2005 |
| The present invention provides a wiring board in which electronic components are embedded by means of an embedding resin which attains a high mounting density of the electronic components in the wiring board, which exhibits excellent electrical properties such as insulating property, |
| 6740411 |
Embedding resin, wiring substrate using same and process for producing wiring substrate using sa |
May 25, 2004 |
| An embedding resin for embedding an electronic part in a wiring substrate, includes at least one of a soluble resin and a soluble organic filler as a soluble component to be dissolved with an oxidizing agent. |
| 6680123 |
Embedding resin |
January 20, 2004 |
| An embedding resin embeds an electronic part in an object and has a dielectric constant of about 5 or less and tan .delta. of about 0.08 or less. |
| 6586827 |
Wiring board and method for fabricating the same |
July 1, 2003 |
| A wiring board includes a substrate having an opening, and an electronic part placed in the opening, wherein a space left in the opening is filled with an embedding resin having a base color tone selected from black, blue, green, red, orange, yellow, and violet. |
| 6569796 |
Dielectric porcelain composition and dielectric resonator using the same |
May 27, 2003 |
| The present invention is directed to a dielectric ceramic composition exhibiting a high unloaded quality factor and a small variation thereof. The dielectric ceramic composition of the invention containing Ba, Zn, and Ta, contains 100 parts by weight of a predominant component represente |
| 6512182 |
Wiring circuit board and method for producing same |
January 28, 2003 |
| The invention relates to a wiring circuit board including an electronic device disposed in a hole of the wiring circuit board; a resin filling the hole such that the electronic device is embedded in the resin; a wiring layer formed on the resin; and an interface between the resin and the |
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