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Richard W. O'Connell Patents
Inventor:
O'Connell; Richard W.
Address:
Austin, TX
No. of patents:
1
Patents:




Patent Number Title Of Patent Date Issued
6166552 Method and apparatus for testing a semiconductor wafer December 26, 2000
A probing apparatus includes a prober (210) and a test head (130) that includes a test head mother board (132). A load board 218 and a probe card (216) are connect to each other and the test head mother board (132) using conductive bumps (219). The need for a table top for the prober (21


 
 
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