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Ernest R. Nolan Patents |
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Inventor: Nolan; Ernest R.
Address: Round Rock, TX
No. of patents: 4
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 5508228 |
Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and |
April 16, 1996 |
| Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The p |
| 5271822 |
Methods and apparatus for electroplating electrical contacts |
December 21, 1993 |
| A method for selectively electroplating a metallic coating, such as solder, onto a plurality of small and closely spaced electrical contacts. The method includes sealingly enclosing the contacts in an electroplating cell having an anode, a cathode and a chamber, forming an electrical con |
| 5223110 |
Apparatus for electroplating electrical contacts |
June 29, 1993 |
| A method and apparatus for selectively electroplating a metallic coating, such as solder, onto a plurality of small and closely spaced electrical contacts. The method includes sealingly enclosing the contacts in an electroplating cell having an anode, a cathode and a chamber, forming an |
| 5216803 |
Method and apparatus for removing bonded connections |
June 8, 1993 |
| Removing welded outer lead bonds of TAB tape leads to contacts on a substrate. The method includes separating the electrical leads adjacent the weld bonds leaving a remnant, engaging the remnant with a shear tool, and moving the tool and bond relative to each other shearing the remnant. |
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