| Patent Number |
Title Of Patent |
Date Issued |
| 7119943 |
Plate-based microelectromechanical switch having a three-fold relative arrangement of contact st |
October 10, 2006 |
| A microelectromechanical system (MEMS) switch is provided which includes a multiple of three support arms extending from the periphery of a moveable electrode. In addition, MEMS switch includes a plurality of contact structures having portions extending into a space between a fixed e |
| 7053736 |
Microelectromechanical device having an active opening switch |
May 30, 2006 |
| A microelectromechanical device is provided which includes a beam configured to apply an opening force on a closed switch. The opening force may be substantially independent of a force stored in the closed switch. A combination of the force applied by the beam and the force stored in |
| 6787438 |
Device having one or more contact structures interposed between a pair of electrodes |
September 7, 2004 |
| A microelectromechanical device is provided which includes a contact structure interposed between a pair of electrodes arranged beneath a beam. In some embodiments, the device may include additional contact structures interposed between the pair of electrodes. For example, the device may |
| 6646215 |
Device adapted to pull a cantilever away from a contact structure |
November 11, 2003 |
| A device is provided which is adapted to electrostatically pull a cantilever away from a conductive pad. In particular, a microelectromechanical device is provided which includes a fulcrum contact structure interposed between two electrodes spaced under a cantilever and a conductive |
| 6529377 |
Integrated cooling system |
March 4, 2003 |
| Systems and methods are described for integrated cooling system. A method includes: circulating a liquid inside a flexible multi-layer tape; and transporting heat between a heat source that is coupled to the flexible multi-layer tape and a heat sink that is coupled to the flexible mu |
| 6437965 |
Electronic device including multiple capacitance value MEMS capacitor and associated methods |
August 20, 2002 |
| An electronic device, such as a filter or phase shifter, for example, includes a substrate, and a MEMS capacitor on the substrate and having a plurality of selectable capacitance values. The MEMS capacitor preferably includes a lower capacitor electrode on the substrate, and a movable |
| 5871657 |
Ink jet printhead with improved adhesive bonding between channel and heater substrates |
February 16, 1999 |
| An improved process is provided for aligning and bonding channel and heater substrates together to form a thermal ink jet printhead. A thick film polyimide layer is formed over the heater substrate and is patterned to provide a plurality of tacking pits. The channel substrate has alignme |
| 5509846 |
Disposable biodegradable beehive |
April 23, 1996 |
| A disposable, biodegradable beehive which comprises an enclosure of wax-coated cardboard. The enclosure includes an opening to allow the bees to enter or exit the beehive and a closure for the opening. Small ventilation holes, relative to the size of a bee, are provided to allow air |
| 5508228 |
Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and |
April 16, 1996 |
| Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The p |
| 5445308 |
Thermally conductive connection with matrix material and randomly dispersed filler containing li |
August 29, 1995 |
| A method of providing a thermally conductive connection between spaced surfaces includes (a) mixing a thermally conductive filler containing a liquid metal into an unhardened matrix material, and (b) contacting the unhardened matrix material and randomly dispersed, separate spaced no |
| 5344795 |
Method for encapsulating an integrated circuit using a removable heatsink support block |
September 6, 1994 |
| A process for making thermosetting or thermoplastic encapsulated integrated circuit having a heat exchanger in which one end of the heat exchanger is encapsulated in the housing adjacent to the integrated circuit and the other end is exposed to the environment beyond the housing portion. |
| 5328087 |
Thermally and electrically conductive adhesive material and method of bonding with same |
July 12, 1994 |
| The present invention discloses a thermally and electrically conductive adhesive material comprising a hardened adhesive, and a non-solidified filler containing a liquid metal dispersed in separate spaced regions of the adhesive. The hardened adhesive provides a mechanical bond whereas t |
| 5265321 |
Integrated circuit structure with heat exchanger elements secured thereto and method of making |
November 30, 1993 |
| An integrated circuit structure and method of making in which the circuit has a plurality of metal heat exchanger elements spaced from each other with their first ends secured to the structure. The first ends may be adhesively secured to an integrated circuit chip or the underlying s |
| 5170930 |
Liquid metal paste for thermal and electrical connections |
December 15, 1992 |
| A thermally and electrically conductive paste for making a detachable and compliant connection between two surfaces. The paste comprises an equilibrium mixture of an electrically conductive liquid metal and particulate solid constituents, wherein at the temperature of the paste durin |
| 5132873 |
Diaphragm sealing apparatus |
July 21, 1992 |
| An article provides sealing of an electronic component connected to a mating fluid heat exchanger by providing a diaphragm with an opening shaped to fit about the heat exchanger, the opening forming a sealing lip. A clamping ring, which expands and contracts as a function of temperature |
| 5056706 |
Liquid metal paste for thermal and electrical connections |
October 15, 1991 |
| A thermally and electrically conductive paste and its method of use for making a detachable and compliant thermal conductive connection between two surfaces or making an electrical connection between first and second electrical components. The paste is comprised of a liquid metal and |
| 5002123 |
Low pressure high heat transfer fluid heat exchanger |
March 26, 1991 |
| A fluid heat exchanger for cooling an electronic component having a housing for receiving heat from the electronic component in which the housing has a fluid inlet and an outlet at opposite ends of the housing. The cross-sectional area of the housing for conveying fluid from the inlet to |
| 4993482 |
Coiled spring heat transfer element |
February 19, 1991 |
| A thermally conductive coiled spring laid on its side provides a compliant, high conductive, low force thermal path between a heat source and a heat sink. Each spring contact provides two parallel heat conduction paths via each coil in the spring. The spring can be canted to permit slida |
| 4953634 |
Low pressure high heat transfer fluid heat exchanger |
September 4, 1990 |
| A fluid heat exchanger for cooling an electronic component having a housing for receiving heat from the electronic component in which the housing has a fluid inlet and an outlet at opposite ends of the housing. The cross-sectional area of the housing for conveying fluid from the inlet to |
| 4940085 |
Fluid heat exchanger for an electronic component |
July 10, 1990 |
| A high performance fluid heat exchanger for cooling an electronic component which includes a housing having a base, a plurality of parallel fins in the housing, a center fed inlet connected to the housing opposite the base for supplying cooling fluid towards the base and toward the ends |
| 4923000 |
Heat exchanger having piezoelectric fan means |
May 8, 1990 |
| A fluid heat exchanger for cooling an electronic component including a housing having a fluid inlet and fluid outlet. Piezoelectric means are connected to a plurality of flexible blades for pumping fluid from the inlet to the outlet. A heat conductive structure is connected to the ho |
| 4909315 |
Fluid heat exchanger for an electronic component |
March 20, 1990 |
| A high performance fluid heat exchanger for cooling an electronic component which includes a housing having a base heat transfer member, a plurality of parallel fins in the housing and center fed concentric inlet and outlet tubes connected to the housing opposite the base for supplying c |
| 4884630 |
End fed liquid heat exchanger for an electronic component |
December 5, 1989 |
| A body having a bottom and first and second ends and a cavity therein. A plurality of substantially parallel spaced fins are positioned in the cavity. A liquid inlet is centrally positioned in the first end of the body and a liquid outlet is centrally positioned in the second end of the |
| 4882654 |
Method and apparatus for adjustably mounting a heat exchanger for an electronic component |
November 21, 1989 |
| A fluid heat exchanger for mating with an electronic component is supported from a fixed support. A connection between the fixed support and the heat exchanger is initially flexible for adjusting the position of the heat exchanger to accommodate variations in the height or attitude of th |
| 4821389 |
Method of making a pin fin heat exchanger |
April 18, 1989 |
| A pin fin heat exchanger is made by wrapping a thermally conductive wire having a coating thereon around a mandrel thereby forming a multilayer coil. The coating is fused together for holding the wires together. The method includes cutting a section out of the coil providing a plurality |
| 4678452 |
Overload release clutch |
July 7, 1987 |
| A lubricant free low cost overload release clutch having a spring housing with an integral hub, a detector ring containing fixed detent bullets for engagement with springs in the housing on one side, and a bullet detent housing on the other side, together with spider cushion and shaft ho |
| 4377747 |
Non-uniform thermal imaging detector |
March 22, 1983 |
| A radiation sensitive detector employed with a thermal radiation scanning system to receive images that are scanned across said detector at predetermined velocities. The detector is sensitive to these scanned images and generates minority photocarriers that drift along the length of |
| 4185292 |
Potential troughs for charge transfer devices |
January 22, 1980 |
| In a surface channel charge transfer device noise due to the presence of surface states is minimized by ion implanting the charge coupled device propagation channel so as to provide a narrow potential trough which confines the charge to the center of the CCD channel. |
| 4176369 |
Image sensor having improved moving target discernment capabilities |
November 27, 1979 |
| A semiconductor image sensor comprises an array of charge collection elements buried within the semiconductor for collecting charge photogenerated in response to the image. This sensor is easily configured to discern changes in an image. One or more charge transfer devices (CTD's) of |
| 4033733 |
Air filter gauge |
July 5, 1977 |
| A gauge detecting the presence of a restriction placed upon an air stream passing through a filter in connection with an internal combustion engine, said gauge including a linear indicator to show the relative restriction present in the filter and including an indicator to show that the |
