A method for forming a pre-metallization layer on an underlying micro-structure, and a corresponding micro-structure formed by the method. The micro-structure may be a semiconductor circuit and/or a Micro-Electro-Mechanical Systems (MEMS) device. A first layer of undoped silicate gla
Methods for protecting the sidewall of a metal interconnect component using Physical Vapor Deposition (PVD) processes and using a single barrier metal material. After forming the metal interconnect component, a single barrier metal is deposited on its sidewall using PVD. A subsequent ani
