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Eric S. Nelson Patents
Inventor:
Nelson; Eric S.
Address:
Charlotte, NC
No. of patents:
8
Patents:




Patent Number Title Of Patent Date Issued
7377988 Positional fixing of a shaft May 27, 2008
The invention concerns the fixing of a bearing shaft (6) in a reception bore (1.3) of a housing, at least one end of the shaft being adapted to be swaged to the reception bore (1.3) for achieving at least one of a force locking and a positive engagement, and an outer peripheral surface
7034560 Device and method for testing integrated circuit dice in an integrated circuit module April 25, 2006
An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins,
6801048 Device and method for testing integrated circuit dice in an integrated circuit module October 5, 2004
An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and
6605956 Device and method for testing integrated circuit dice in an integrated circuit module August 12, 2003
An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and
6256811 Fiber optic starlight furniture July 10, 2001
A fiber optic illuminated starlight scene on a headboard. By using a plurality of optical fibers (22) lighted by an illuminator (20) and the optical fiber/visible end (16) are positioned flush with front panel (12) decorative scene (14) a realistic rendition of a starlight scene is c
6240535 Device and method for testing integrated circuit dice in an integrated circuit module May 29, 2001
An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and
5796746 Device and method for testing integrated circuit dice in an integrated circuit module August 18, 1998
An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable pad to one of the MCM's no-connection (N/C) pins, and a resi
5154444 Air bag retainer with cutting flaps October 13, 1992
A cover assembly for an air bag restraint system has a smooth outer skin with a backing layer of foam located between the outer skin cover and a retainer member. The retainer member is located above the outlet of an air bag casing and includes a plurality of flaps therein each having a p


 
 
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