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Tadato Nagasawa Patents |
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Inventor: Nagasawa; Tadato
Address: Tokyo, JP
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7179724 |
Wafer processing method |
February 20, 2007 |
| A method of processing a wafer having devices in a plurality of areas sectioned by streets arranged in a lattice pattern on the front surface to form a metal film on a back surface thereof, wherein a laser beam application step for applying a laser beam capable of passing through a |
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