| Patent Number |
Title Of Patent |
Date Issued |
| 7400790 |
Optical connections and methods of forming optical connections |
July 15, 2008 |
| In one embodiment, an assembly having a first board, a second board, a fiber bundle, and at least one movable stage is provided. The fiber bundle has a first end and a second end, and the first end of the fiber bundle is attached to the first board first face. The movable stage has a |
| 7344315 |
Optical connections and methods of forming optical connections |
March 18, 2008 |
| In one embodiment, a fiber assembly is provided. The fiber assembly has a first fiber having at least one core. The core has a length, a first end, and a second end, and light may be transmitted along the core. The second end has an obtusely angled end surface. The assembly also has a se |
| 7274851 |
Fiber optic module |
September 25, 2007 |
| Various embodiments of a fiber optic module adapted for use in an electronic assembly and system are provided. Multiple embodiments of a method of interfacing an electronic assembly with an external circuit through use of the fiber optic module are also provided. In one embodiment, t |
| 7269321 |
System and method of configuring fiber optic communication channels between arrays of emitters a |
September 11, 2007 |
| A system for configuring fiber optic communication channels between arrays of emitters and detectors comprises: an array of light emitters; an array of light detectors; a bundle of optical fibers disposed between the arrays of light emitters and light detectors for conducting light from |
| 7251388 |
Apparatus for providing optical communication between integrated circuits of different PC boards |
July 31, 2007 |
| Optical communication apparatus comprises: a first IC assembly disposed at a first PCB and comprising: a first IC package electrically coupled to circuits of the first PCB and having an opening in a bottom layer thereof; a first array of optical elements disposed in and electrically |
| 7229218 |
Apparatus and method of providing an optical connection between PC boards for optical communicat |
June 12, 2007 |
| Apparatus for connecting an interconnecting cable between first and second printed circuit (PC) boards comprises: a base member disposed on a side of the first PC board for fixedly attaching one end of the interconnecting cable to the first PC board; a first connector attached to the |
| 7214100 |
Cable assembly |
May 8, 2007 |
| A cable assembly comprising a hollow sleeve, an electrical conductor within the hollow sleeve, and first and second connectors on opposing ends of the electrical conductor that are fastened to opposing ends of the sleeve. The first connector is adapted to blind-mate to a correspondin |
| 7118285 |
Optical connections and methods of forming optical connections |
October 10, 2006 |
| In one embodiment, fiber assemblies are provided. The fiber assemblies may have a first fiber and a second fiber. The first fiber may have at least one core having a length and first and second ends. The second end may have a first connector. The second fiber may have at least one core |
| 7000314 |
Method for providing flexible circuit using discrete wiring |
February 21, 2006 |
| A method for providing electrical signal transmission and a secure mechanical attachment in a flexible circuit assembly. The inventive mechanism combines the electrical features of discrete wiring with the mechanical features of etched pads connected to plated vias on flex circuits i |
| 6975514 |
Integrated VCSELs on traditional VLSI packaging |
December 13, 2005 |
| A circuit module including at least one Application Specific Integrated Circuit (ASIC) and a plurality of Vertical Cavity Surface-Emitting Laser (VCSEL) array modules is built using a standard ceramic or organic VLSI package substrate, resulting is a high density device with a small |
| 6922496 |
Integrated VCSELs on ASIC module using flexible electrical connections |
July 26, 2005 |
| A circuit module including at least one Application Specific Integrated Circuit (ASIC) and a plurality of Vertical Cavity Surface-Emitting Laser (VCSEL) array modules is built using a standard ceramic or organic Multi-Chip Module (MCM) package substrate, resulting is a high density d |
| 6862185 |
Systems and methods that use at least one component to remove the heat generated by at least one |
March 1, 2005 |
| One embodiment of the invention is a system comprising a first component that generates heat, and a second component that is thermally connected to the first component, wherein the heat from the first component is transferred to a coolant through the second component, and the second |
| 6734045 |
Lossy RF shield for integrated circuits |
May 11, 2004 |
| A low-cost EMI shield that fits around an integrated circuit package to absorb electromagnetic energy and dissipate it as heat. The shield is not ohmically conductive so it may contact electrically active conductors without affecting the operation of the circuit. EMI is prevented from |
| 6711021 |
Systems and methods that use at least one component to remove the heat generated by at least one |
March 23, 2004 |
| One embodiment of the invention is a system comprising a first component that generates heat, and a second component that is thermally connected to the first component, wherein the from the first component is transferred to a coolant through the second component, and the second component |
| 6580610 |
Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump |
June 17, 2003 |
| An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the point of evaporation. Condensing |
| 6507492 |
Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump |
January 14, 2003 |
| An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the point of evaporation. Condensing |
| 6507101 |
Lossy RF shield for integrated circuits |
January 14, 2003 |
| A low-cost EMI shield that fits around an integrated circuit package to absorb electromagnetic energy and dissipate it as heat. The shield is not ohmically conductive so it may contact electrically active conductors without affecting the operation of the circuit. EMI is prevented from |
| 6486408 |
Flexible circuit using discrete wiring |
November 26, 2002 |
| A system and method is described which provides for electrical signal transmission and a secure mechanical attachment in a flexible circuit assembly. The inventive mechanism combines the electrical features of discrete wiring with the mechanical features of etched pads connected to p |
| 6452789 |
Packaging architecture for 32 processor server |
September 17, 2002 |
| The inventive system uses a backplane to interconnect a plurality of modular cell boards. Each cell board comprises a plurality of processors, a processor controller chip, a memory subsystem, and a power subsystem. The processor controller chip manages communications between components o |
| 6377458 |
Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump |
April 23, 2002 |
| An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the point of evaporation. Condensing |
| 6316944 |
Effective netlength calculation |
November 13, 2001 |
| The invention accurately determines propagation delay for a sawtooth pattern. Through measurement, the actual delays added per bend in the sawtooth pattern are determined and the values are then used in a CAD tool. The invention can add a known amount of propagation delay to a wire l |
| 6313523 |
IC die power connection using canted coil spring |
November 6, 2001 |
| A semiconductor device assembly according to the present invention may comprise a semiconductor die having at least one contact pad thereon and a package substrate having at least one lead pad thereon. The package substrate is sized to receive the semiconductor die so that the contact |
| 6312973 |
IC die power connection using canted coil spring |
November 6, 2001 |
| A semiconductor device assembly according to the present invention may comprise a semiconductor die having at least one contact pad thereon and a package substrate having at least one lead pad thereon. The package substrate is sized to receive the semiconductor die so that the contact |
| 6309262 |
Bifurcated contact with a connecting member at the tip of the contact that provides redundant co |
October 30, 2001 |
| A connector with multiple redundant contact points is disclosed. The multiple redundant contacts are provided by a bifurcated contact with a joining member at the tip of the contact. |
| 6280201 |
Laminated 90-degree connector |
August 28, 2001 |
| A connector for electrically and mechanically connecting two circuit boards at a substantially 90-degree angle. The 90-degree connector may include surface mount devices, connections for mechanically attaching to circuit boards, surface mount pads or pins for electrically connecting to t |
| 6183316 |
Connector with redundant contact points |
February 6, 2001 |
| A connector with multiple redundant contact points is disclosed. The multiple contacts are formed by a main contact point on a main beam and an auxiliary contact point connected to the main beam by a secondary beam in the shape of a loop or spring. |
| 6152790 |
Bifurcated contact with a connecting member that can add redundant contact points to single poin |
November 28, 2000 |
| A connector with multiple redundant contact points that can withstand surface imperfections during card insertion is disclosed. One implementation is a bifurcated contact with a joining member at the tip of the contact that can be added onto a single point connector designs. |
| 6061222 |
Method and apparatus for reducing noise in integrated circuit chips |
May 9, 2000 |
| A method and apparatus for reducing noise in integrated circuit chips (ICs). The apparatus comprises on-die capacitance in conjunction with one or more resistive loss elements, which provide an AC termination for on-die power events. The on-die capacitance can be instantiated in metal |
| 6020749 |
Method and apparatus for performing testing of double-sided ball grid array devices |
February 1, 2000 |
| A system and method of constructing and using a test module in situations where internal access to test points on a substrate are unavailable because devices mounted on the substrate block physical access. The test module is itself a solderable substrate and is imposed, for testing p |
| 5883788 |
Backing plate for LGA mounting of integrated circuits facilitates probing of the IC's pins |
March 16, 1999 |
| A backing plate facilitates electrical probing of VLSI IC signals in an array of signal via pads on the back side of a printed circuit board and which correspond to an LGA of socket pads on the front side of the printed circuit board. The backing plate is constructed of electrically non |
| 5838550 |
Grounding clip for shielded modular connector |
November 17, 1998 |
| A shortened ground path for the shield of a shielded modular connector (e.g., RJ-45, etc.) mounted against a bracket that is to be seated against a slot in a chassis is provided by a metallic grounding clip that slips over the bracket. The clip has edges that have been folded to slidably |
| 5708400 |
AC coupled termination of a printed circuit board power plane in its characteristic impedance |
January 13, 1998 |
| High speed power supply transients are suppressed in a system having fast edges and where a radial transmission line exists between the power supply and ground planes, by terminating the edges of the PCB in it characteristic impedance. In practice, this means approximating a continuo |
