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Osamu Miyagawa Patents
Inventor:
Miyagawa; Osamu
Address:
Yokkaichi, JP
No. of patents:
1
Patents:




Patent Number Title Of Patent Date Issued
7312158 Method of forming pattern December 25, 2007
A method of forming a pattern, including forming first and second films, and a resist film on the second film, patterning the resist film to form a first pattern, etching the first pattern to narrow a width of the lines of the first pattern, etching the second film by using the first pat


 
 
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