| Patent Number |
Title Of Patent |
Date Issued |
| 7413691 |
In-mold metallized polymer components and method of manufacturing same |
August 19, 2008 |
| A method is provided for forming a net shape molded component that includes an integral metallized coating or layer on the exterior surface thereof. The method includes injecting a carefully matched mixture of a molten polymer resin and a molten metallic alloy into a mold cavity under |
| 7311140 |
Heat sink assembly with overmolded carbon matrix |
December 25, 2007 |
| A net-shape molded heat sink is provided which includes a thermally conductive main body and a number of thermally conductive fins integrally connected to and emanating from the main body. The heat sink is formed by overmolding a carbon-carbon matrix core plate with a thermally conductiv |
| 7236344 |
Ionic flow generator for thermal management |
June 26, 2007 |
| The apparatus for generating ionic flow of media includes a DC voltage supply having a positive terminal and a negative terminal with a collector connected to the negative terminal of the direct current voltage supply. The collector has a substantially tubular configuration with a re |
| 7094822 |
Thermally conductive elastomeric pad |
August 22, 2006 |
| The present invention relates to thermally conductive, elastomeric pads. The pads can be made by injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally conductive filler mat |
| 7038009 |
Thermally conductive elastomeric pad and method of manufacturing same |
May 2, 2006 |
| The present invention relates to thermally conductive, elastomeric pads and methods for manufacturing such pads. The methods involve injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume |
| 7013555 |
Method of applying phase change thermal interface materials |
March 21, 2006 |
| The present invention discloses a method of providing an integral thermal interface on an interface surface of a heat dissipation device, such as a heat sink. In accordance with the present invention, the phase change material is applied directly onto the interface surface of the heat si |
| 6981805 |
Molded electronic connector formed from a thermally conductive polymer composition and method of |
January 3, 2006 |
| An electronic connector having a housing containing a circuit board with a heat-generating component, such as a photodiode or laser, is provided. The housing is molded over the circuit board and heat-generating component. The housing is made from a moldable, thermally conductive poly |
| 6899160 |
Method of forming a thermally conductive article using metal injection molding material with hig |
May 31, 2005 |
| The present invention discloses a conductive injection molding composition. The thermally conductive composition includes a metallic base matrix of, by volume, between 30 and 60 percent. A first thermally conductive filler, by volume, between 25 and 60 percent is provided in the composit |
| 6886625 |
Elastomeric heat sink with a pressure sensitive adhesive backing |
May 3, 2005 |
| The present invention discloses a net-shape molded elastomeric heat-dissipating device that includes an integrally formed conformable interface surface. A base elastomeric matrix material is loaded with thermally conductive filler and injected into a mold cavity to form the completed |
| 6868602 |
Method of manufacturing a structural frame |
March 22, 2005 |
| A structural frame (12) for dissipating heat from an electronic device (10) is provided. The structural frame (12), to which an electronic circuit board (14) containing a heat generating electronic component (16) is mounted, is injection molded from a thermally conductive, net-shape |
| 6863729 |
Nozzle insert for long fiber compounding |
March 8, 2005 |
| A new die insert for an extrusion machine and a method of using the invention that includes a continuous strand of fiber reinforcing material to be statically drawn directly to the center of the molten flow of polymer base matrix is provided. The insert is placed in line with the dis |
| 6851869 |
Highly thermally conductive electronic connector |
February 8, 2005 |
| The electronic connector (10) includes an improved heat dissipating housing for cooling heat generating devices located within the connector (10). The electronic connector (10) of the present invention enables the cost-effective cooling of electronic devices (22, 24) within the connector |
| 6835347 |
Method of forming a highly thermally conductive and high strength article |
December 28, 2004 |
| A highly thermally conductive and high strength net-shape moldable molding composition, with a thermal conductivity above 4 W/m.degree. K and a strength of at least 15 ksi includes a polymer base matrix of, by volume, between 30 and 70 percent. A first highly thermally conductive filler |
| 6828672 |
Thermally conductive silk-screenable interface material |
December 7, 2004 |
| A novel visible light curable composition for forming a thermally conductive interface and a method of using the same is provided. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat si |
| 6827470 |
Thermally conductive lamp reflector |
December 7, 2004 |
| A thermally conductive lamp reflector is provided that dissipates heat from a light source within the reflector. The reflector assembly includes a shell having a metallized layer on its surface. The shell is made from a composition including about 30% to about 80% by volume of a base pol |
| 6817096 |
Method of manufacturing a heat pipe construction |
November 16, 2004 |
| A method of manufacturing a heat pipe construction includes first providing a tubular pipe with an open end. A thermally conductive material, such as a metallic material or a filled polymer composite material is overmolded over or cast around the tubular pipe. Additional heat dissipating |
| 6803328 |
Print thermally conductive interface assembly |
October 12, 2004 |
| A novel visible light curable composition for forming a thermally conductive interface and a method of using the same is provided. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat si |
| 6783716 |
Nozzle insert for long fiber compounding |
August 31, 2004 |
| A new die insert for an extrusion machine and a method of using the invention that includes a continuous strand of fiber reinforcing material to be statically drawn directly to the center of the molten flow of polymer base matrix. The insert is placed in line with the discharge end o |
| 6756005 |
Method for making a thermally conductive article having an integrated surface and articles produ |
June 29, 2004 |
| The present invention relates to a method of manufacturing a thermally conductive article having an integrated thermally conductive surface. The method involves molding a first thermally conductive composition to form a body of the article and then molding a second thermally conductive |
| 6710109 |
Thermally conductive and high strength injection moldable composition |
March 23, 2004 |
| A highly thermally conductive and high strength net-shape moldable molding composition, with a thermal conductivity above 4 W/m.degree. K and a strength of at least 15 ksi includes a polymer base matrix of, by volume, between 30 and 70 percent. A first highly thermally conductive filler |
| 6681487 |
Method of manufacturing a composite overmolded heat pipe |
January 27, 2004 |
| The present invention discloses a method of constructing a heat pipe that includes providing a heat pipe with phase change media therein and injection overmolding the heat pipe with a conductive composition. The thermally conductive composition absorbs or reflects electro magnetic in |
| 6680015 |
Method of manufacturing a heat sink assembly with overmolded carbon matrix |
January 20, 2004 |
| A net-shape molded heat sink is provided which includes a thermally conductive main body and a number of thermally conductive fins integrally connected to and emanating from the main body. The heat sink is formed by overmolding a carbon-carbon matrix core plate with a thermally conductiv |
| 6649108 |
Method of manufacturing a U-shaped heat sink assembly |
November 18, 2003 |
| A method of manufacturing a net-shape moldable U-shaped heat sink assembly includes injection molding a thermally conductive polymer composite material. The method includes forming a heat sink assembly base member with a number of integrated fins members thereon. A right upstanding wall |
| 6635959 |
Thermally conductive silk-screenable interface material |
October 21, 2003 |
| The present invention provides a novel visible light curable composition for forming a thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device |
| 6585039 |
Composite overmolded heat pipe construction |
July 1, 2003 |
| The present invention discloses a heat pipe construction that includes a heat pipe with phase change media therein with a conductive composition molded about the heat pipe. The thermally conductive composition absorbs or reflects electro magnetic interference waves and prevents their |
| 6557859 |
Injection moldable elastomeric gasket |
May 6, 2003 |
| A net-shape molded elastomeric gasket for dissipating heat and providing electro-magnetic interference (EMI) shielding for an electronic device is formed by loading a base elastomeric matrix material with thermally conductive filler and EMI reflective metallic filler and injecting the |
| 6555486 |
Thermally conductive silk-screenable interface material |
April 29, 2003 |
| The present invention provides a novel visible light curable composition for forming a thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device |
| 6547001 |
Flexible glove-like heat sink |
April 15, 2003 |
| A heat sink assembly for removing heat from an object having an outer surface includes a main body with an object receiving seat. A pair of flexible securing tabs are connected to the free edge of the open end of the main body which emanate into the open end of the main body. A heat |
| 6543524 |
Overplated thermally conductive part with EMI shielding |
April 8, 2003 |
| A net-shape molded heat transfer component is provided which includes a thermally conductive core and a metallic coating for reflection of electromagnetic interference and radio frequency waves. The heat transfer component is formed by net-shape molding a core body from a thermally c |
| 6540948 |
Injection molding apparatus with bleed off pocket for overmolding heat pipes |
April 1, 2003 |
| A method of overmolding a heat pipe includes providing an injection mold apparatus having a cavity, an input gate, a bleed off overflow gate in communication with the cavity and a tubular heat pipe charged with phase change media which is capable of being collapsed by imparting an extern |
| 6503964 |
Polymer composition with metal coated carbon flakes |
January 7, 2003 |
| A thermally conductive and electromagnetic interference and radio frequency reflective polymer composition and a method for creating the same is disclosed. Thermally conductive filler material is coated with a thermally conductive and electromagnetic interference and radio frequency refl |
| 6487073 |
Thermally conductive electronic device case |
November 26, 2002 |
| A case for dissipating heat from an electronic device is provided. The case includes an electronic circuit board with a heat generating electronic component installed thereon. A shield is positioned over the electronic component to protect it from electromagnetic interference. The shield |
| 6478997 |
Polymer heat pipe with carbon core |
November 12, 2002 |
| A polymer heat pipe with a carbon core and a method of forming such a heat pipe is disclosed. The heat pipe includes a substantially pure carbon fiber core and an outer jacket of substantially pure polymer material. The heat pipe is formed by extruding a mixture of a base of polymer mate |
| 6407149 |
Method of manufacturing an evenly colored thermally conductive composite |
June 18, 2002 |
| A method of molding an evenly colored, thermally conductive composition. Thermally conductive filler material is colored and mixed with a base polymer matrix. The mixture is molded into the desired shape. The step of for coloring the filler material is tailored to the type of thermally |
| 6397941 |
Net-shape molded heat exchanger |
June 4, 2002 |
| A net-shape molded heat exchanger is provided which includes a thermally conductive main body and a number of thermally conductive arms connected to and extending from the main body. A number of thermally conductive fins are connected to the arms. The heat exchanger is formed by net-shap |
| 6385047 |
U-shaped heat sink assembly |
May 7, 2002 |
| A net-shape moldable U-shaped heat sink assembly formed by injection molding of a thermally conductive polymer composite material is shown. The heat sink assembly includes a base member with a number of integrated fins members thereon. A right upstanding wall extends from a first side of |
| 6367541 |
Conforming heat sink assembly |
April 9, 2002 |
| A conforming heat sink assembly for removing heat from heat generating components, having respective top surfaces defining different heights is provided with a flexible thermally conductive base member with a top surface and a bottom surface. The bottom surface is adapted to be posit |
| 6261495 |
Process of molding a polymer reinforced with particles |
July 17, 2001 |
| A plunger machine for molding reinforced polymer is provided. The plunger machine has particular application in molding polymer that is reinforced with particles having an aspect ratio greater than 1:1. The plunger machine includes a barrel housing with a smooth barrel bore that defines |
| 6251978 |
Conductive composite material |
June 26, 2001 |
| A conductive net-shape moldable molding composition, with a thermal conductivity above 22 W/m.degree.K and a volume electrical resistivity of 0.1 ohm-cm or lower and a surface electrical resistivity of 1.0 ohm or lower, is provided. The thermally and electrically conductive composition |
| 6237223 |
Method of forming a phase change heat sink |
May 29, 2001 |
| A method of forming a phase change passive heat sink, with a base member and heat dissipating members, is provided. The base member is hollow and defines an evaporation chamber therein. A number of heat dissipating members are connected to the base member. Each of the heat dissipating |
| 6214263 |
Method of molding a reinforced article |
April 10, 2001 |
| A method of molding a reinforced article for optimizing heat transfer, electrical conductivity and/or structural integrity is provided. A mold assembly is first provided which is capable of forming an article of a desired configuration. The desired positioning of the filler within the |
| 6201697 |
Heat sink assembly with cam lock |
March 13, 2001 |
| A heat sink assembly, having a number of mounting holes therethrough, is installed on a heat generating surface of an electronic component for removing heat therefrom. A heat dissipating member having a base portion having a bottom surface and an upper surface with heat dissipating e |
| 6139783 |
Method of molding a thermally conductive article |
October 31, 2000 |
| A method of molding a thermally conductive article for transferring heat from a heat generating surface is provided. A mold assembly is first provided which is capable of forming an article of a desired configuration. The initial location of contact on the article with the heat gener |
| 6093961 |
Heat sink assembly manufactured of thermally conductive polymer material with insert molded meta |
July 25, 2000 |
| An molded heat sink assembly includes an integrally molded attachment clip for securing the assembly to a semiconductor package to be cooled. The assembly removes heat from a semiconductor device package having opposing side wall edges. The heat sink assembly also includes a heat conduct |
| 6048919 |
Thermally conductive composite material |
April 11, 2000 |
| A conductive molding composition, with a thermal conductivity above 22 W/m.degree. K., is provided. The thermally conductive composition includes a polymer base matrix of, by volume, between 30 and 60 percent. A first thermally conductive filler, by volume, between 25 and 60 percent is |
| 6014315 |
Heat sink assembly with multiple pressure capability |
January 11, 2000 |
| A heat dissipating device which can provide multiple levels of pressure to a semiconductor package, having an outer peripheral ceramic region and an inner silicon region, is provided. A top cover member is provided with a central female-threaded bore. The top member is secured to the cer |
| 5945736 |
Heat sink assembly with snap-in cover plate having multiple pressure capability |
August 31, 1999 |
| A heat dissipating device which can provide multiple levels of pressure to a semiconductor package, having an outer peripheral ceramic region and an inner silicon region, is provided. A top cover member is provided with a central female-threaded bore. The top member is secured, without t |
