| Patent Number |
Title Of Patent |
Date Issued |
| 7332436 |
Process of removing residue from a precision surface using liquid or supercritical carbon dioxid |
February 19, 2008 |
| A composition which includes liquid or supercritical carbon dioxide and an acid having a pKa of less than about 4. The composition is employed in a process of removing residue from a precision surface, such as a semiconductor sample, in which the precision surface is contacted with t |
| 7056837 |
Process of insulating a semiconductor device using a polymeric material |
June 6, 2006 |
| A dielectric material formed by contacting a low dielectric constant polymer with liquid or supercritical carbon dioxide, under thermodynamic conditions which maintain the carbon dioxide in the liquid or supercritical state, wherein a porous product is formed. Thereupon, thermodynami |
| 6890855 |
Process of removing residue material from a precision surface |
May 10, 2005 |
| A process of removing residue from an etched precision surface. In this process the etched precision surface is contacted with a composition which includes liquid or supercritical carbon dioxide and a fluoride-generating species. |
| 6838015 |
Liquid or supercritical carbon dioxide composition |
January 4, 2005 |
| A composition which includes liquid or supercritical carbon dioxide and an acid having a pKa of less than about 4. The composition is employed in a process of removing residue from a precision surface, such as a semiconductor sample, in which the precision surface is contacted with the |
| 6834671 |
Check valve for micro electro mechanical structure devices |
December 28, 2004 |
| A check valve for micro electro mechanical structure devices (MEMS), and in particular pertains to a check valve which is adapted to be employed in connection with micro electro mechanical structure devices which are intended to be employed with supercritical fluids constituting working |
| 6739346 |
Apparatus for cleaning filters |
May 25, 2004 |
| A process and apparatus for cleaning filters prior to recycling or disposal. In this process and apparatus liquid or supercritical carbon dioxide contacts the plugged pores of a filter under conditions in which carbon dioxide remains in the liquid or supercritical state. |
| 6683008 |
Process of removing ion-implanted photoresist from a workpiece |
January 27, 2004 |
| A process of removing photoresist, previously subjected to ion implantation, from the surface of a workpiece. The process involves contacting the workpiece with a composition which includes liquid or supercritical carbon dioxide and between about 2% and about 20% of an alkanol having |
| 6653233 |
Process of providing a semiconductor device with electrical interconnection capability |
November 25, 2003 |
| A process of providing a semiconductor device with electrical interconnection capability wherein a sacrificial material is introduced into topographical features of the semiconductor device prior to chemical mechanical polishing so that debris formed during chemical mechanical polish |
| 6622507 |
Electromechanical device and a process of preparing same |
September 23, 2003 |
| An electromechanical device having a size no larger than about 10 microns utilizing a working fluid in the high pressure liquid or supercritical fluid state. A process of preparing the electromechanical device involves the introduction of the liquid or supercritical fluid therein which |
| 6579464 |
Fixtures for processing a workpiece in a supercritical fluid |
June 17, 2003 |
| Fixtures and methods for clamping workpieces in a workplace to enable the optimized exposure thereof to a stream or flow of a supercritical fluid. Provided is a rotatably indexable chuck or locator mounting the workpiece and enabling orientating the latter in specific static pitch positi |
| 6509136 |
Process of drying a cast polymeric film disposed on a workpiece |
January 21, 2003 |
| A process of drying a cast film polymeric disposed upon a workpiece. In this process a cast polymeric film, which includes a volatile organic compound therein, disposed on a workpiece, is contacted with an extraction agent which may be liquid carbon dioxide or supercritical carbon dioxid |
| 6457480 |
Process and apparatus for cleaning filters |
October 1, 2002 |
| A process and apparatus for cleaning filters prior to recycling or disposal. In this process and apparatus liquid or supercritical carbon dioxide contacts the plugged pores of a filter under conditions in which carbon dioxide remains in the liquid or supercritical state. |
| 6454869 |
Process of cleaning semiconductor processing, handling and manufacturing equipment |
September 24, 2002 |
| A process of cleaning semiconductor processing, handling and manufacturing equipment in which such equipment is contacted with a cleaning effective amount of liquid or supercritical carbon dioxide. |
| 6451375 |
Process for depositing a film on a nanometer structure |
September 17, 2002 |
| A process of depositing a thin film on a nanometer structure in which a coating, which may be an aerogel material or metallic seed layer, is prepared. The coating is combined with a supercritical composition to form a supercritical coating composition. The supercritical coating compositi |
| 6425956 |
Process for removing chemical mechanical polishing residual slurry |
July 30, 2002 |
| A process of removing residual slurry resulting from chemical mechanical polishing of a workpiece in which the workpiece is contacted with a composition of a supercritical fluid, said supercritical fluid including supercritical, carbon dioxide and a co-solvent, and a surfactant. |
| 6398875 |
Process of drying semiconductor wafers using liquid or supercritical carbon dioxide |
June 4, 2002 |
| A process of drying a semiconductor wafer which includes at least one microelectric structure disposed thereon which includes contacting a water-containing thin film-covered semiconductor wafer with a composition which includes liquid or supercritical carbon dioxide and a surfactant. |
| 6346484 |
Method for selective extraction of sacrificial place-holding material used in fabrication of air |
February 12, 2002 |
| The present invention relates to formation of air gaps in metal/insulator interconnect structures, and to the use of supercritical fluid (SCF)-based methods to extract sacrificial place-holding materials to form air gaps in a structure. Supercritical fluids have gas-like diffusivities an |
| 5976264 |
Removal of fluorine or chlorine residue by liquid CO.sub.2 |
November 2, 1999 |
| A method for the removal of fluorine or chlorine residue from an etched precision surface such as a semiconductor sample is provided which comprises exposing said precision surface to liquid CO.sub.2 under appropriate conditions that are sufficient to remove the residue from the prec |
| 5908510 |
Residue removal by supercritical fluids |
June 1, 1999 |
| A method for the removal of residue from an etched precision surface such as a semiconductor sample is provided which comprises exposing said precision surface to a supercritical fluid or liquid CO.sub.2 under appropriate conditions that are sufficient to remove the residue from the |
| 5780363 |
Etching composition and use thereof |
July 14, 1998 |
| An aqueous etchant composition containing about 0.01 to about 15 percent by weight of sulfuric acid and about 0.01 to about 20 percent by weight of hydrogen peroxide or about 1 to 30 ppm of ozone is effective in removing polymer residue from a substrate, and especially from an integrated |
