| Patent Number |
Title Of Patent |
Date Issued |
| 7044417 |
High speed transfer takeup |
May 16, 2006 |
| An apparatus for transferring material winding between spools. The apparatus includes spindels for positioning first and second spools in a co-planar arrangement with parallel axes of rotation. With the material initially secured to the base of a first spool with tape, a winding mech |
| 6586558 |
Process for making PEN/PET blends and transparent articles therefrom |
July 1, 2003 |
| Process for controlling the change of intrinsic viscosity and transesterification during solid stating of a polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) blend, with an effective amount of an ethylene glycol compound. The process enables the production of a copo |
| 6395865 |
Process for making pen/pet blends and transparent articles therefrom |
May 28, 2002 |
| Process for controlling the change of intrinsic viscosity and transesterification during solid stating of a polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) blend, with an effective amount of an ethylene glycol compound. The process enables the production of a copo |
| 6194536 |
Process for making pen/pet blends and transparent articles therefrom |
February 27, 2001 |
| The present invention relates to a process for controlling the change of intrinsic viscosity and transesterification during solid stating of a polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) blend, with an effective amount of an alkylene glycol compound. The process |
| 6171888 |
Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assem |
January 9, 2001 |
| One or two, or more, additional conductive layers, separated from one another (if two or more) and separated from a patterned (signal) conductive layer are formed in a flexible substrate, for mounting a semiconductor die in a semiconductor device assembly. These additional layers are |
| 5872404 |
Interconnect bump for flip-chip integrated circuit including integral standoff and hourglass sha |
February 16, 1999 |
| An interconnect bump is formed on a substrate structure of a flip-chip microelectronic integrated circuit by sputtering a metal base layer on the substrate, and then forming a copper standoff on the base layer. A solder cap is formed on the standoff having a peripheral portion that exten |
| 5763952 |
Multi-layer tape having distinct signal, power and ground planes, semiconductor device assembly |
June 9, 1998 |
| One or two, or more, additional conductive layers, separated from one another (if two or more) and separated from a patterned (signal) conductive layer are formed in a flexible substrate, for mounting a semiconductor die in a semiconductor device assembly. These additional layers are |
| 5698465 |
Process for manufacturing an interconnect bump for flip-chip integrated circuit including integr |
December 16, 1997 |
| A process where in an interconnect bump is formed on a substrate structure of a flip-chip microelectronic integrated circuit by sputtering a metal base layer on the substrate, and then forming a copper standoff on the base layer. A solder cap is formed on the standoff having a peripheral |
| 5681777 |
Process for manufacturing a multi-layer tab tape semiconductor device |
October 28, 1997 |
| One or two, or more, additional conductive layers, separated from one another (if two or more) and separated from a patterned (signal) conductive layer are formed in a flexible substrate, for mounting a semiconductor die in a semiconductor device assembly. These additional layers are |
| 5466635 |
Process for making an interconnect bump for flip-chip integrated circuit including integral stan |
November 14, 1995 |
| An interconnect bump is formed on a substrate structure of a flip-chip microelectronic integrated circuit by sputtering a metal base layer on the substrate, and then forming a copper standoff on the base layer. A solder cap is formed on the standoff having a peripheral portion that exten |
| 5466635 |
Process for making an interconnect bump for flip-chip integrated circuit including integral stan |
November 14, 1995 |
| An interconnect bump is formed on a substrate structure of a flip-chip microelectronic integrated circuit by sputtering a metal base layer on the substrate, and then forming a copper standoff on the base layer. A solder cap is formed on the standoff having a peripheral portion that exten |
| 5447229 |
Cot/tab protective shipping apparatus and method |
September 5, 1995 |
| Industry-standard COT/TAB integrated circuit part carrier frame members are receivable into a shipping tube member in a stack which rests at one end on paired retaining pins and at the other end is retained by a closure member of the shipping tube. As so disposed in the shipping tube, th |
| 5118333 |
Apparatus for contacting a preform rod to cause the preform rod to have a substantially straight |
June 2, 1992 |
| In order to provide a substrate such as an optical preform rod (24) which is suitable for insertion into a tube and which has a transverse cross section that is substantially circular and disposed concentrically about a longitudinal axis of the substrate substantially along its entire le |
| 5030266 |
Apparatus for adjusting the configuration of optical substrates |
July 9, 1991 |
| In order to provide a substrate such as an optical preform rod (24) which is suitable for insertion into a tube and which has a transverse cross section that is substantially circular and disposed concentrically about a longitudinal axis of the substrate substantially along its entire le |
| 4875916 |
Methods of adjusting the configuration of optical substrates |
October 24, 1989 |
| In order to provide a substrate such as an optical preform rod (24) which suitable for insertion into a tube and which has a transverse cross section that is substantially circular and disposed concentrically about a longitudinal axis of the substrate substantially along its entire leng |
| 4601740 |
Methods of and apparatus for at least partially closing an end portion of an optical preform tub |
July 22, 1986 |
| A preform from which lightguide fiber is drawn is made by depositing optically suitable layers of doped silicon dioxide on an inner wall of a rotating glass tube (31) which is exposed to a moving zone of heat (56) which is provided by a torch assembly (50) during a deposition mode and |
| 4582480 |
Methods of and apparatus for vapor delivery control in optical preform manufacture |
April 15, 1986 |
| A vapor delivery system for the manufacture of an optical preform includes a deposition bubbler (60) and another bubbler (40) referred to as a supply bubbler which is interposed between a reservoir (24) of a liquid and the deposition bubbler. Heat energy is applied to the supply bubbler |
| 4486214 |
Methods of and apparatus for collapsing a preform tube into a preform from which lightguide fibe |
December 4, 1984 |
| A lightguide fiber preform is made by depositing optically suitable layers of doped silicon dioxide on an inner wall of a rotating glass substrate tube (31) which is exposed to a moving zone of heat during a deposition mode and during a mode when the tube is collapsed. During each of a |
| 4477273 |
Method of and apparatus for straightening and configuring a preform tube from which lightguide f |
October 16, 1984 |
| A preform from which lightguide fiber is drawn is made by depositing optically suitable layers of doped silicon dioxide on an inner wall of a rotating glass substrate tube which is exposed to a moving zone of heat during a deposition mode and during a collapse mode. During at least a |
| 4253583 |
Closure for container |
March 3, 1981 |
| A closure which is particularly useful to seal a container of material that is used in a process for the manufacture of preforms from which fiber lightguides are drawn includes an annular seal having a tapered opening therethrough. The annular seal is supported in engagement with an |
| 4231777 |
Methods of and apparatus for heating a glass tube |
November 4, 1980 |
| In order to react gases and/or vapors to deposit optically suitable layers of doped silicon dioxide on an inner wall of a glass substrate tube to produce a preform from which optical fibers are drawn, the glass tube is heated by a mixture of combustible gases. The combustible gases are |
| 4224105 |
Apparatus for simultaneously covering each of a plurality of elongated materials with uniformly |
September 23, 1980 |
| Paper pulp insulation of uniform weight per unit length is formed simultaneously on each of a plurality of advancing electrical conductors (21--21) by the use of a dual zone headbox (23) which cooperates with a forming cylinder (24). In one zone of the headbox, the average velocity of |
| 4184913 |
Methods of simultaneously covering each of a plurality of elongated materials with uniformly wei |
January 22, 1980 |
| Paper pulp insulation of uniform weight per unit length is formed simultaneously on each of a plurality of advancing electrical conductors (21--21) by the use of a dual zone headbox (23) which cooperates with a forming cylinder (24). In one zone of the headbox, the average velocity of |
| 3983303 |
Method of manufacturing articles from metal coated with a zirconium nitride layer |
September 28, 1976 |
| A method of manufacturing metal parts containing an element which is attacked by lead comprising coating the metal parts with zirconium nitride by treatment with a zirconium-containing metal melt. |
