| Patent Number |
Title Of Patent |
Date Issued |
| 7422516 |
Conductive polishing article for electrochemical mechanical polishing |
September 9, 2008 |
| Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad sandwiched between the |
| 7390744 |
Method and composition for polishing a substrate |
June 24, 2008 |
| Polishing compositions and methods for removing conductive materials and barrier materials from a substrate surface are provided. Polishing compositions are provided for removing at least a barrier material from a substrate surface by a chemical mechanical polishing process or by an |
| 7390429 |
Method and composition for electrochemical mechanical polishing processing |
June 24, 2008 |
| A method of processing a substrate having a conductive material layer disposed thereon is provided which includes positioning the substrate in a process apparatus and supplying a first polishing composition between to the substrate. The polishing composition comprises a first chelating |
| 7384534 |
Electrolyte with good planarization capability, high removal rate and smooth surface finish for |
June 10, 2008 |
| Electrolyte compositions and methods for planarizing a surface of a substrate using the electrolyte compositions are provided. In one aspect, an electrolyte composition includes one or more chelating agents, one or more corrosion inhibitors, and one or more pH adjusting agents. In an |
| 7375023 |
Method and apparatus for chemical mechanical polishing of semiconductor substrates |
May 20, 2008 |
| Methods and apparatus for processing substrates to improve polishing uniformity, improve planarization, remove residual material and minimize defect formation are provided. In one aspect, a method is provided for processing a substrate having a conductive material and a low dielectric |
| 7374644 |
Conductive polishing article for electrochemical mechanical polishing |
May 20, 2008 |
| Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of |
| 7344431 |
Pad assembly for electrochemical mechanical processing |
March 18, 2008 |
| Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A first set of holes |
| 7323416 |
Method and composition for polishing a substrate |
January 29, 2008 |
| Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate |
| 7278911 |
Conductive polishing article for electrochemical mechanical polishing |
October 9, 2007 |
| Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly therewith. |
| 7232514 |
Method and composition for polishing a substrate |
June 19, 2007 |
| Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, |
| 7229535 |
Hydrogen bubble reduction on the cathode using double-cell designs |
June 12, 2007 |
| An apparatus and method for planarizing a surface of a substrate using a chamber separated into two parts by a membrane, and two separate electrolytes is provided. The embodiments of the present invention generally provide an electrochemical mechanical polishing system that reduces t |
| 7210988 |
Method and apparatus for reduced wear polishing pad conditioning |
May 1, 2007 |
| Embodiments of a conditioning head for in-situ conditioning and/or cleaning a processing pad of a CMP, ECMP, or other processing system are provided. In one embodiment, the conditioning head includes a brush disposed in a central cavity. A cleaning fluid is provided through the centr |
| 7207878 |
Conductive polishing article for electrochemical mechanical polishing |
April 24, 2007 |
| Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substra |
| 7160432 |
Method and composition for polishing a substrate |
January 9, 2007 |
| Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate |
| 7128825 |
Method and composition for polishing a substrate |
October 31, 2006 |
| Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, |
| 7104869 |
Barrier removal at low polish pressure |
September 12, 2006 |
| The invention generally provides methods and compositions for planarizing a substrate surface having underlying dielectric materials. Aspects of the invention provide compositions and methods using a combination of low polishing pressures, polishing compositions, various polishing speeds |
| 7084064 |
Full sequence metal and barrier layer electrochemical mechanical processing |
August 1, 2006 |
| A method and apparatus for electrochemically processing metal and barrier materials is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of establishing an electrically-conductive path through an electrolyte between an exposed layer |
| 7077721 |
Pad assembly for electrochemical mechanical processing |
July 18, 2006 |
| Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A first set of holes |
| 7060606 |
Method and apparatus for chemical mechanical polishing of semiconductor substrates |
June 13, 2006 |
| Methods and apparatus for processing substrates to improve polishing uniformity, improve planarization, remove residual material and minimize defect formation are provided. In one aspect, a method is provided for processing a substrate having a conductive material and a low dielectric |
| 7008554 |
Dual reduced agents for barrier removal in chemical mechanical polishing |
March 7, 2006 |
| Compositions and methods for removal of barrier layer materials by a chemical mechanical polishing technique are provided. In one aspect, the invention provides a composition adapted for removing a barrier layer material in a chemical mechanical polishing technique including at least |
| 6991528 |
Conductive polishing article for electrochemical mechanical polishing |
January 31, 2006 |
| Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substra |
| 6991526 |
Control of removal profile in electrochemically assisted CMP |
January 31, 2006 |
| Aspects of the invention generally provide a method and apparatus for polishing a substrate using electrochemical deposition techniques. In one aspect, an apparatus for polishing a substrate comprises a counter-electrode and a pad positioned between a substrate and the counter-electr |
| 6979248 |
Conductive polishing article for electrochemical mechanical polishing |
December 27, 2005 |
| An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coated with a conductive |
| 6962524 |
Conductive polishing article for electrochemical mechanical polishing |
November 8, 2005 |
| Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of |
| 6899804 |
Electrolyte composition and treatment for electrolytic chemical mechanical polishing |
May 31, 2005 |
| An electrolyte composition and method for planarizing a surface of a wafer using the electrolyte composition is provided. In one aspect, the electrolyte composition includes ammonium dihydrogen phosphate, diammonium hydrogen phosphate, or a mixture thereof. The composition has a pH betwe |
| 6863797 |
Electrolyte with good planarization capability, high removal rate and smooth surface finish for |
March 8, 2005 |
| Electrolyte compositions and methods for planarizing a surface of a substrate using the electrolyte compositions are provided. In one aspect, an electrolyte composition includes one or more chelating agents, one or more corrosion inhibitors, and one or more pH adjusting agents. In anothe |
| 6821881 |
Method for chemical mechanical polishing of semiconductor substrates |
November 23, 2004 |
| Methods and apparatus for processing substrates to improve polishing uniformity, improve planarization, remove residual material and minimize defect formation are provided. In one aspect, a method is provided for processing a substrate having a conductive material and a low dielectric |
| 6776693 |
Method and apparatus for face-up substrate polishing |
August 17, 2004 |
| A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a basin and a polishing head. A carrier is disposed in the basin and has a substrate supporting surface. A retaining ring is disposed on the carrier and a |
