| Patent Number |
Title Of Patent |
Date Issued |
| 7064428 |
Wafer-level package structure |
June 20, 2006 |
| A wafer-level package structure, applicable to a flip-chip arrangement on a carrier, which comprises a plurality of contact points, is described. This wafer-level package structure is mainly formed with a chip and a conductive layer. The conductive layer is arranged on the bonding pads o |
| 6989326 |
Bump manufacturing method |
January 24, 2006 |
| A method of forming bumps on the active surface of a silicon wafer. A first under-bump metallic layer is formed over the active surface of the wafer. A second under-bump metallic layer is formed over the first under-bump metallic layer. A portion of the second under-bump metallic lay |
| 6967153 |
Bump fabrication process |
November 22, 2005 |
| A bump fabrication process for forming a bump over a wafer having a plurality of bonding pads thereon is provided. A patterned solder mask layer having a plurality of openings that exposes the respective bonding pads is formed over a wafer. The area of the opening in a the cross-sect |
| 6927964 |
Structure for preventing burnt fuse pad from further electrical connection |
August 9, 2005 |
| A semiconductor device with a capability can prevent a burnt fuse pad from re-electrical connection, wherein the semiconductor device includes a bump pad and a fuse pad over a wafer. The fuse pad includes the burnt fuse pad having a gap for electrical isolation. The semiconductor device |
| 6877653 |
Method of modifying tin to lead ratio in tin-lead bump |
April 12, 2005 |
| A method of modifying the tin to lead ratio of a tin-lead bump forms a patterned solder mask over a substrate that comprises a first tin-lead bump formed thereon, the patterned solder mask having an opening that exposes the tin-lead bump. A solder material including tin and lead is f |
| 6875683 |
Method of forming bump |
April 5, 2005 |
| A method of forming a bump on an active surface of a wafer is disclosed. The method of the invention forms an under ball metallurgy (UBM) onto the active surface of the wafer. Then, the UBM is partially removed until a portion of the active surface of the wafer is exposed. At least one |
| 6861346 |
Solder ball fabricating process |
March 1, 2005 |
| A solder ball fabricating process for forming solder balls over a wafer having an active layer is provided. A patterned solder mask layer is formed over the active surface of the wafer. The patterned solder mask layer has an opening that exposes a bonding pad on the wafer. Solder mat |
| 6846719 |
Process for fabricating wafer bumps |
January 25, 2005 |
| A wafer bump fabrication process is provided in the present invention. A wafer with multiple bonding pads and a passivation layer, which exposes the bonding pads, is provided. The surface of each bonding pad has an under bump metallurgy layer. A patterned photoresist layer with a plu |
| 6828664 |
Packaging substrate with electrostatic discharge protection |
December 7, 2004 |
| The present invention relates to a packaging substrate with electrostatic discharge protection. The packaging substrate is disposed in a recess of a mold and comprises an outer wall electrically connecting an inner wall of the recess. A first copper-mesh layer and a second copper-mesh la |
| 6827252 |
Bump manufacturing method |
December 7, 2004 |
| A method of forming bumps on the active surface of a silicon wafer. An under-ball metallic layer is formed over the active surface of the wafer. A plurality of first solder blocks is attached to the upper surface of the under-ball metallic layer. Each first solder block has an upper surf |
| 6756256 |
Method for preventing burnt fuse pad from further electrical connection |
June 29, 2004 |
| A method for preventing burnt fuse pads from further electrical connection suitable before the formation of bumps on the wafer. A dielectric layer is formed over the active surface of the wafer covering the bump pads and the fuse pads of the wafer, wherein a central region of the fuse pa |
| 6743707 |
Bump fabrication process |
June 1, 2004 |
| The present invention provides a bump fabrication process. A wafer is provided with a patterned photoresist layer formed on the wafer. The patterned photoresist layer has a plurality of openings, corresponding to bonding pads. A conductive layer is formed on the photoresist layer and |
| 6732912 |
Solder ball attaching process |
May 11, 2004 |
| A solder ball attaching process for attaching solder balls to a wafer is provided. First, an under-ball-metallurgy layer is formed on the active surface of the wafer. Patterned masking layers are sequentially formed over the active surface of the wafer. The masking layers together form a |
| 6723630 |
Solder ball fabrication process |
April 20, 2004 |
| A solder ball fabrication process for forming solder balls over a wafer having an active layer is provided. A plurality of patterned solder mask layers is sequentially formed over the active surface of the wafer. Each patterned solder mask layer has at least an opening that exposes a sol |
| 6720244 |
Bump fabrication method |
April 13, 2004 |
| A bump fabrication method is described. The method comprises the steps of providing a wafer having an active surface and a plurality of bonding pads formed on the active surface; respectively forming an under bump metallurgy layer onto the bonding pads, wherein the under bump metallurgy |
| 6716739 |
Bump manufacturing method |
April 6, 2004 |
| A method of forming bumps on the active surface of a silicon wafer. A first under-ball metallic layer is formed over the active surface of the wafer. A second under-ball metallic layer is formed over the first under-ball metallic layer. A portion of the second under-ball metallic layer i |
| 6713320 |
Bumping process |
March 30, 2004 |
| A bumping process wherein a substrate is first provided with many electrical connections. Subsequently, the bumps on the bump transfer substrate are pressed onto the electrical connections of the substrate accompanying a heating process and then the bumps are transferred onto the ele |
| 6692581 |
Solder paste for fabricating bump |
February 17, 2004 |
| A solder paste for fabricating bumps includes a flux and metallic alloy powder. The metallic alloy powder includes a plurality of low eutectic metallic alloy granules, and the size of these metallic alloy granules is 20-60 .mu.m and the average size of the metallic granules is 35 .mu.m t |
| 6673711 |
Solder ball fabricating process |
January 6, 2004 |
| A solder ball fabricating process for forming solder balls over a wafer having an active layer is provided. A patterned solder mask layer is formed over the active surface of the wafer. The patterned solder mask layer has an opening that exposes a bonding pad on the wafer. Solder mat |
| 6617237 |
Lead-free bump fabrication process |
September 9, 2003 |
| A lead-free solder bump fabrication process for producing a plurality of lead-free solder bumps over a wafer is provided. The lead-free solder bump fabrication process includes forming a lead-free pre-formed solder bump over each bonding pad on the wafer and then forming a patterned sold |
