| Patent Number |
Title Of Patent |
Date Issued |
| 7372497 |
Effective method to improve sub-micron color filter sensitivity |
May 13, 2008 |
| An image sensor device and method for forming said device are described. The image sensor structure comprises a substrate with photodiodes, an interconnect structure formed on the substrate, a color filter layer above the interconnect structure, a first microlens array, an overcoat l |
| 7264976 |
Advance ridge structure for microlens gapless approach |
September 4, 2007 |
| A method of manufacturing a plurality of microlenses on a substrate comprises forming a grid having raised ridges defining a plurality of openings on the substrate and forming a plurality of patterned photoresist features each disposed within one of the plurality of openings. The plu |
| 7102542 |
Apparatus and method for determining output signals according to pressure and depressing time |
September 5, 2006 |
| An apparatus and a method for determining output signals according to pressure and depressing time mainly includes a timer, a scanner and a keyboard connecting electronically to the timer and the scanner. The keyboard has a plurality of button keys. When in use, the timer is set to z |
| 6964916 |
Image sensor fabrication method and structure |
November 15, 2005 |
| A method for processing a semiconductor substrate includes providing a substrate having at least one filter region with a plurality of bond pads in it. Metal is deposited above the bond pads, to reduce the bond pad step height. A planarization layer is formed such that the deposited meta |
| 6956253 |
Color filter with resist material in scribe lines |
October 18, 2005 |
| A color filter includes a substrate having a plurality of scribe lines arranged to form at least one filter region surrounded by the scribe lines. The scribe lines are at least partially filled with a resist material. At least one color resist layer is formed above the substrate with |
| 6861207 |
Method for fabricating microlens with lithographic process |
March 1, 2005 |
| A method of fabricating microlens devices. The method includes filling the bond pad areas and scribe lines, or other areas, to improve the topography of the semiconductor wafer surface. A microlens material is applied to the surface after the bond pad areas and scribe lines have been fil |
| 6849533 |
Method for fabricating microelectronic product with attenuated bond pad corrosion |
February 1, 2005 |
| A method for fabricating a microelectronic product provides for forming a planarizing layer upon a bond pad and a topographic feature, both formed laterally separated over a substrate. The planarizing layer is formed with a diminished thickness upon the bond pad such that it may be readi |
| 6660641 |
Method for forming crack resistant planarizing layer within microelectronic fabrication |
December 9, 2003 |
| Within a method for forming a planarizing layer within a microelectronic fabrication, there is employed formed upon a partially photoexposed planarizing layer formed of a partially photoexposed negative photoresist material a sacrificial layer. Within the method, when sequentially: (1) |
| 6590239 |
Color filter image array optoelectronic microelectronic fabrication with a planarizing layer for |
July 8, 2003 |
| Within a method for forming a color filter image array optoelectronic microelectronic fabrication, and the color filter image array optoelectronic microelectronic fabrication formed employing the method, there is provided a substrate having formed therein a series of photo active reg |
