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Frank Koschinsky Patents
Inventor:
Koschinsky; Frank
Address:
Radebeul, DE
No. of patents:
4
Patents:




Patent Number Title Of Patent Date Issued
7063091 Method for cleaning the surface of a substrate June 20, 2006
A cleaning process for cleaning the surface of a substrate is disclosed, wherein the surface comprises portions of a dielectric material and portions of a conductive material. According to the method disclosed, the temperature at the surface of the substrate is kept below a predefined
6964874 Void formation monitoring in a damascene process November 15, 2005
The invention provides a technique of monitoring the void formation in a damascene interconnection process. According to the invention, a test structure is provided that includes at least two damascene structures that have at least one different cross-sectional geometric parameter. To
6716650 Interface void monitoring in a damascene process April 6, 2004
For determining the quality of interconnections in integrated circuits, especially in damascene applications, a method of monitoring voids is disclosed, wherein a barrier metal layer is directly deposited on a planarized metal to provide a large-area surface that is not required to b
6613660 Metallization process sequence for a barrier metal layer September 2, 2003
In an in situ damascene metallization process employing a barrier layer between the metal and the dielectric, the generation of voids, especially at the bottom of vias, can be significantly reduced or even completely avoided by maintaining the surface temperature below a critical tem


 
 
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