| Patent Number |
Title Of Patent |
Date Issued |
| 7411299 |
Passivation film of semiconductor device |
August 12, 2008 |
| Disclosed are a method of manufacturing a semiconductor device and a structure of a semiconductor device. A method of forming a passivation film of a semiconductor device comprises the steps of forming metal wires on a semiconductor substrate, forming a buffer oxide film being a first |
| 7393621 |
Toner composition for electrophotography image forming apparatus |
July 1, 2008 |
| A toner composition for an electrophotography image forming apparatus includes toner particles and external additives. The toner particles include a colorant, a charge control agent and a release agent with binder resins. The external additives include a first silica having an opposi |
| 7393620 |
Toner composition |
July 1, 2008 |
| A toner composition includes toner particles containing a colorant, a binder, a charge control agent, a releasing agent, and an external additive containing silica, silicon carbide, magnesium stearate, and polyvinylidene fluoride. The toner composition of the present invention has a |
| 7282420 |
Method of manufacturing a flash memory device |
October 16, 2007 |
| A method of manufacturing a flash memory device wherein a stacked structure of an oxide and nitride or the reverse is applied to insulation spacers provided on sidewalls of gates for forming source/drain regions. After completing the source/drain regions, spacers are formed on sidewa |
| 7229912 |
Method for forming passivation film of semiconductor device and structure of passivation film of |
June 12, 2007 |
| Disclosed are a method of manufacturing a semiconductor device and a structure of a semiconductor device. A method of forming a passivation film of a semiconductor device comprises the steps of forming metal wires on a semiconductor substrate, forming a buffer oxide film being a first |
| 7179735 |
Method of manufacturing semiconductor device |
February 20, 2007 |
| Provided is a method of manufacturing a semiconductor device. According to the present invention, it is possible that an interlayer insulating film is planarized by forming the interlayer insulating film using multiple simultaneous deposition-and-etch processes without carrying out a |
