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Michael Kiene Patents
Inventor:
Kiene; Michael
Address:
Radebeul, DE
No. of patents:
1
Patents:




Patent Number Title Of Patent Date Issued
7022602 Nitrogen-enriched low-k barrier layer for a copper metallization layer April 4, 2006
The effect of resist poisoning may be eliminated or at least substantially reduced in the formation of a low-k metallization layer, in that a nitrogen-containing barrier layer is provided with a surface modified by plasma treatment. Consequently, diffusion of nitrogen and nitrogen co


 
 
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