| Patent Number |
Title Of Patent |
Date Issued |
| 7414305 |
Carrier for stacked type semiconductor device and method of fabricating stacked type semiconduct |
August 19, 2008 |
| A carrier for a stacked-type semiconductor device includes an accommodating section for accommodating stacked semiconductor devices, guide portions guiding the stacked semiconductor devices, and grooves through which a fluid may flow to the accommodating section and to sides of the s |
| 7285848 |
Carrier for stacked type semiconductor device and method of fabricating the same |
October 23, 2007 |
| A carrier for a stacked type semiconductor device includes a lower carrier having a first accommodating portion that accommodates a first semiconductor device, and an upper carrier having a second accommodating portion that accommodates a second semiconductor device stacked on the fi |
| 7144754 |
Device having resin package and method of producing the same |
December 5, 2006 |
| A device including a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the |
| 6881611 |
Method and mold for manufacturing semiconductor device, semiconductor device and method for moun |
April 19, 2005 |
| A method includes a resin sealing step of placing, in a cavity 28 of a mold 20, a substrate 16 to which semiconductor elements 11 on which bumps 12 are arranged, a resin sealing step of supplying resin 35 to positions of the bumps 12 so that a resin layer 13 sealing the bumps 12 is forme |
| 6856017 |
Device having resin package and method of producing the same |
February 15, 2005 |
| A device including a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the |
| 6696754 |
Semiconductor module including a plurality of semiconductor devices detachably |
February 24, 2004 |
| A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably. |
| 6573121 |
Semiconductor device, method for fabricating the semiconductor device, lead frame and method for |
June 3, 2003 |
| A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically |
| 6566999 |
Anti-collision support system and method for automotive vehicle |
May 20, 2003 |
| In anti-collision support method and apparatus for an automotive vehicle, a deceleration magnitude adjustment manipulation distance which is another vehicular running distance required to carry out a manipulation of an adjustment for a magnitude of the vehicular deceleration which would |
| 6528346 |
Bump-forming method using two plates and electronic device |
March 4, 2003 |
| First and second ball forming plates are prepared. The cavities of the first plate and the cavities of the second plate 20 are filled with solder paste, respectively. The first plate and the second plate are placed in a facing relationship to each other and heated to form metal balls eac |
| 6495773 |
Wire bonded device with ball-shaped bonds |
December 17, 2002 |
| A wire bonding method includes a first bonding process for forming a first ball-shaped part in a wire and bonding the first ball-shaped part to a first connected member; a ball-shaped part forming process for guiding the wire away from a position where the wire is bonded to an inner lead |
| 6476503 |
Semiconductor device having columnar electrode and method of manufacturing same |
November 5, 2002 |
| A semiconductor device including a semiconductor chip sealed with an encapsulating resin. Columnar electrodes are connected to electrode pads of the semiconductor chip, and extend through the encapsulating resin. The columnar electrodes are made from bonding wires and include enlarged ou |
| 6472744 |
Semiconductor module including a plurality of semiconductor devices detachably |
October 29, 2002 |
| A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably. |
| 6379997 |
Semiconductor device and method of producing the same and semiconductor device unit and method o |
April 30, 2002 |
| A semiconductor device includes a semiconductor element, a holding substrate holding the semiconductor element, a frame body provided on the holding substrate so as to surround the semiconductor element and having a hole which communicates to a space formed between the holding substrate |
| 6376921 |
Semiconductor device, method for fabricating the semiconductor device, lead frame and method for |
April 23, 2002 |
| A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically |
| 6207477 |
Semiconductor device having a ball grid array and a fabrication process thereof |
March 27, 2001 |
| A method of fabricating a semiconductor device includes a step of attaching a circuit substrate on a semiconductor wafer in alignment with each other, providing an electrical interconnection between the circuit substrate and semiconductor devices formed in the wafer, providing solder bum |
| 6111306 |
Semiconductor device and method of producing the same and semiconductor device unit and method o |
August 29, 2000 |
| A semiconductor device includes a semiconductor element, a holding substrate holding the semiconductor element, a frame body provided on the holding substrate so as to surround the semiconductor element and having a hole which communicates to a space formed between the holding substrate |
| 6104160 |
Household power supply system using electric vehicle |
August 15, 2000 |
| A household power supply system using an electric vehicle, comprises an external power system, a house with an indoor power line, an electric vehicle having a vehicle power system with vehicle batteries, a charger/discharger for connecting separably the indoor power line and the vehi |
| 6090301 |
Method for fabricating bump forming plate member |
July 18, 2000 |
| A method for fabricating a bump forming plate member by which bumps can be formed on an electronic component. A mask is formed on a surface of a crystalline plate, and the crystalline plate is subjected to anisotropic etching to form a plurality of grooves. The crystalline plate is also |
| 6072239 |
Device having resin package with projections |
June 6, 2000 |
| A device includes a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the |
| 6034428 |
Semiconductor integrated circuit device having stacked wiring and insulating layers |
March 7, 2000 |
| A semiconductor device includes a semiconductor chip, and a multi-layered member connected to the semiconductor chip. The multi-layered member includes one or a plurality of wiring layers and one or a plurality of insulating layers alternately stacked. The one or the plurality of ins |
| 6025650 |
Semiconductor device including a frame terminal |
February 15, 2000 |
| This invention relates to a semiconductor device in which a plurality of outer terminals are arranged in a lattice formation on a flat surface. The semiconductor device comprises a semiconductor chip having a plurality of pads, a resin portion sealing said semiconductor chip and a termin |
| 6025258 |
Method for fabricating solder bumps by forming solder balls with a solder ball forming member |
February 15, 2000 |
| A method for fabricating solder bumps onto a semiconductor chip. A solder ball forming member having a flat surface and a plurality of cavities arranged on the flat surface in a predetermined pattern is prepared. The cavities are then filled with a solder paste, and the solder ball formi |
| 6022759 |
Method for producing a semiconductor device, base member for semiconductor device and semiconduc |
February 8, 2000 |
| A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the |
| 5889333 |
Semiconductor device and method for manufacturing such |
March 30, 1999 |
| A semiconductor device includes a device body including at least an LSI chip, and a lead structure having a base which is flexible and a plurality of pins which project from both sides of the base. The lead structure is integrated with the device body so that first ends of the plurality |
| 5861669 |
Semiconductor package for surface mounting |
January 19, 1999 |
| A semiconductor device having a package of a single in-line type includes a semiconductor chip, a package body that accommodates the semiconductor chip therein and defined by a pair of opposing major surfaces and a plurality of interconnection leads held by the package body to extend |
| 5842628 |
Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming meth |
December 1, 1998 |
| A wire bonding method includes a first bonding process for forming a first ball-shaped part in a wire and bonding the first ball-shaped part to a first connected member; a ball-shaped part forming process for guiding the wire away from a position where the wire is bonded to an inner lead |
| 5831332 |
Semiconductor package for surface mounting |
November 3, 1998 |
| A semiconductor device having a package of a single in-line type includes a semiconductor chip, a package body that accommodates the semiconductor chip therein and defined by a pair of opposing major surfaces and a plurality of interconnection leads held by the package body to extend |
| 5804467 |
Semiconductor device and method of producing the same |
September 8, 1998 |
| A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling t |
| 5801439 |
Semiconductor device and semiconductor device unit for a stack arrangement |
September 1, 1998 |
| A semiconductor device includes a semiconductor element, a package sealing the semiconductor element, and leads for passing signals between the semiconductor element and an external device. Each of the leads has an inner-lead part sealed within the package and connected with the semi |
| 5786985 |
Semiconductor device and semiconductor device unit |
July 28, 1998 |
| A semiconductor device is adapted to be mounted on a circuit substrate in an approximate vertical position. The semiconductor device includes a semiconductor chip, a stage having a first surface and a second surface opposite to the first surface, where the semiconductor chip is mounted o |
| 5773313 |
Semiconductor device and method of producing the same |
June 30, 1998 |
| A semiconductor device includes a semiconductor chip (11) having a top surface and a bottom surface, a plurality of leads (14) arranged under the bottom surface of the semiconductor chip (11), where the leads (14) have first ends (14a) electrically coupled to the semiconductor chip (11) |
| 5760471 |
Semiconductor device having an inner lead extending over a central portion of a semiconductor de |
June 2, 1998 |
| A semiconductor device including a semiconductor element, and leads connected with the semiconductor element. Each of the leads includes an outer lead part for being connected externally. The semiconductor device further includes a plastic package sealing the semiconductor element and |
| 5750421 |
Semiconductor device, carrier for carrying semiconductor device, and method of testing and produ |
May 12, 1998 |
| A semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer |
| 5747874 |
Semiconductor device, base member for semiconductor device and semiconductor device unit |
May 5, 1998 |
| A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the |
| 5736428 |
Process for manufacturing a semiconductor device having a stepped encapsulated package |
April 7, 1998 |
| A process for manufacturing semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semicondu |
| 5684675 |
Semiconductor device unit having holder |
November 4, 1997 |
| A semiconductor device unit includes a holder having a plurality of holding parts, and a plurality of semiconductor devices held by the holding parts of the holder. Each of the semiconductor devices has a generally parallelepiped shape with top and bottom surfaces and at least one side |
| 5679978 |
Semiconductor device having resin gate hole through substrate for resin encapsulation |
October 21, 1997 |
| A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling t |
| 5666064 |
Semiconductor device, carrier for carrying semiconductor device, and method of testing and produ |
September 9, 1997 |
| A semiconductor device comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads of the leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that |
| 5643831 |
Process for forming solder balls on a plate having apertures using solder paste and transferring |
July 1, 1997 |
| A method for fabricating a semiconductor device using a solder ball forming plate having cavities. The plate is made from a silicon plate having a flat surface in a <110> crystallographic plane, and an orientation flat in a <1-11> crystallographic plane. The cavities are form |
| 5637923 |
Semiconductor device, carrier for carrying semiconductor device |
June 10, 1997 |
| A semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer |
| 5637915 |
Semiconductor device affixed to an upper and a lower leadframe |
June 10, 1997 |
| A semiconductor device includes a semiconductor chip having top and bottom surfaces, upper leads electrically coupled to the semiconductor chip, where a first gap is formed between the upper leads and the top surface of the semiconductor chip, lower leads electrically coupled to the |
| 5574310 |
Semiconductor package for surface mounting with reinforcing members on support legs |
November 12, 1996 |
| A semiconductor device having a package of a single in-line type includes a semiconductor chip, a package body that accommodates the semiconductor chip therein and defined by a pair of opposing major surfaces and a plurality of interconnection leads held by the package body to extend |
| 5569625 |
Process for manufacturing a plural stacked leadframe semiconductor device |
October 29, 1996 |
| A semiconductor process includes a stage, a semiconductor chip which is mounted on the stage, a plurality of electrode members which are wire bonded to the semiconductor chip, where a first gap is formed between the stage and one electrode member and a second gap is formed between two |
| 5530292 |
Semiconductor device having a plurality of chips |
June 25, 1996 |
| Two semiconductor chips are coupled to outer leads by means of tape leads so that the chips are spaced apart from each other. A space between the chips is filled with a mold resin. |
| 5521432 |
Semiconductor device having improved leads comprising palladium plated nickel |
May 28, 1996 |
| A semiconductor device includes a semiconductor chip, a die-pad on which the semiconductor chip is mounted, a package encapsulating the die pad and the semiconductor chip, and a plurality of leads electrically connected to the semiconductor chip and projecting from the package, wherein e |
| 5519251 |
Semiconductor device and method of producing the same |
May 21, 1996 |
| A semiconductor device includes a semiconductor chip (11) having a top surface and a bottom surface, a plurality of leads (14) arranged under the bottom surface of the semiconductor chip (11), where the leads (14) have first ends (14a) electrically coupled to the semiconductor chip (11) |
| 5508565 |
Semiconductor device having a plurality of chips having identical circuit arrangement sealed in |
April 16, 1996 |
| A semiconductor device includes a first chip having a circuit arrangement, and a plurality of first terminals formed on a main surface of the first chip and substantially arranged into a line. The semiconductor device also includes a second chip having a circuit arrangement identical to |
| 5475259 |
Semiconductor device and carrier for carrying semiconductor device |
December 12, 1995 |
| A semiconductor device comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads of the leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that |
| 5463253 |
Semiconductor device having a plurality of chips |
October 31, 1995 |
| A semiconductor device includes lead frames (21) respectively having first main surfaces and second main surfaces opposite to each other, bonding being able to be performed on the first and second main surfaces, a first semiconductor chip (22) arranged on first main surface sides of the |
| 5451815 |
Semiconductor device with surface mount package adapted for vertical mounting |
September 19, 1995 |
| A semiconductor device includes vertical placement part for mounting the semiconductor device on a surface of a circuit board in a vertical position, and a connection part for making electrical connections between the circuit board and a semiconductor element. A stage is provided on |
