| Patent Number |
Title Of Patent |
Date Issued |
| 7397128 |
Semiconductor device and method of manufacturing the same |
July 8, 2008 |
| Disclosed is a semiconductor device in which emitter pad electrodes connected to an active region, collector and base pad electrodes are formed on a surface of a semiconductor substrate. Furthermore, on a back surface of the semiconductor substrate, a backside electrode is formed. Mo |
| 7264997 |
Semiconductor device including inclined cut surface and manufacturing method thereof |
September 4, 2007 |
| A semiconductor device comprises a semiconductor element and electrodes electrically connected to the semiconductor element, the semiconductor element and the electrodes being sealed by a sealing agent having an insulating property, the electrodes being exposed around a mounting surf |
| 7256497 |
Semiconductor device with a barrier layer and a metal layer |
August 14, 2007 |
| This invention provides a semiconductor device that can minimize deterioration of electric characteristics of the semiconductor device while minimizing the amount of etching required. In the semiconductor device of the invention, a pad electrode layer formed of a first barrier layer |
| 7241679 |
Method of manufacturing semiconductor device |
July 10, 2007 |
| This invention provides an etching method for preventing deformation of an opening without extremely lowering productivity. This invention has a process for bonding a supporting board on a front surface of a semiconductor substrate to cover a pad electrode formed on the semiconductor |
| 7183589 |
Semiconductor device with a resin-sealed optical semiconductor element |
February 27, 2007 |
| To provide a semiconductor device 10, which is thin, compact, and excellent in mechanical strength and humidity resistance. Semiconductor device 10A has a configuration such that in semiconductor device 10A, wherein an optical semiconductor element 14, having a light receiving part o |
| 7056768 |
Cutting method and method of manufacturing semiconductor device |
June 6, 2006 |
| A cutting method for separating individual semiconductor devices by cutting boundary portions in a group of semiconductor devices made up by arranging a plurality of semiconductor devices in which a ductile first layer and a second layer are stacked on a peripheral side thereof, the |
| 6899802 |
Method for recycling of plating solutions |
May 31, 2005 |
| In the conventional plating process, plating solutions are newly prepared and the plating solutions used previously are dumped as industrial wastes, which is accompanied by environmental loads, effluent costs, costs for purchasing new solutions, and the like, and the present invention ca |
