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Hideki Kabayama Patents |
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Inventor: Kabayama; Hideki
Address: Kawasaki, JP
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 6803655 |
Semiconductor integrated circuit device with EMI prevention structure |
October 12, 2004 |
| A power lead and a ground lead are connected to corresponding pads of a die through an intra-package wiring substrate. A ground plane is formed in a mold under the intra-package wiring substrate extending along the bottom surface of the mold, and connected to the ground lead. A decouplin |
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