| Patent Number |
Title Of Patent |
Date Issued |
| 7338891 |
Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and |
March 4, 2008 |
| A semiconductor chip for flip chip bonding, a mounting structure for the semiconductor chip, and methods for forming a semiconductor chip for flip chip bonding and for fabricating a printed circuit board for a mounting structure of a semiconductor chip are provided which may improve |
| 7307342 |
Interconnection structure of integrated circuit chip |
December 11, 2007 |
| An interconnection structure includes an integrated circuit (IC) chip having internal circuitry and a terminal to electrically connect the internal circuitry to an external circuit, a passivation layer disposed on a top surface of the IC chip, the passivation layer configured to prot |
| 7300864 |
Method for forming solder bump structure |
November 27, 2007 |
| A solder bump structure may be formed using a dual exposure technique of a photoresist, which may be a positive photoresist. The positive photoresist may be coated on an IC chip. First openings may be formed at first exposed regions of the photoresist by a first exposure process. Met |
| 7271084 |
Reinforced solder bump structure and method for forming a reinforced solder bump |
September 18, 2007 |
| A reinforced solder bump connector structure is formed between a contact pad arranged on a semiconductor chip and a ball pad arranged on a mounting substrate. The semiconductor chip includes at least one reinforcing protrusion extending upwardly from a surface of an intermediate laye |
| 7214604 |
Method of fabricating ultra thin flip-chip package |
May 8, 2007 |
| Provided is a method of fabricating an ultra thin flip-chip package. In the above method, an under barrier metal film is formed on a bond pad of a semiconductor chip. Three-dimensional structured solder bumps are formed on the under barrier metal film, each of the solder bumps includ |
| 7208842 |
Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and |
April 24, 2007 |
| A semiconductor chip for flip chip bonding, a mounting structure for the semiconductor chip, and methods for forming a semiconductor chip for flip chip bonding and for fabricating a printed circuit board for a mounting structure of a semiconductor chip are provided which may improve |
| 7151009 |
Method for manufacturing wafer level chip stack package |
December 19, 2006 |
| Provided is a method for manufacturing WLCSP devices that includes preparing at least two wafers, each wafer having a plurality of corresponding semiconductor chips, each semiconductor chip having through electrodes formed in the peripheral surface region, forming or applying a solid |
| 7132358 |
Method of forming solder bump with reduced surface defects |
November 7, 2006 |
| A method of forming a solder bump may involve forming a first photoresist pattern on a wafer having a pad. The first photoresist pattern may have an opening that exposes a portion of the pad. A first under bump metallurgy (UBM) layer may be formed on the pad, and a second UBM layer m |
| 7119425 |
Stacked multi-chip semiconductor package improving connection reliability of stacked chips |
October 10, 2006 |
| The chip package includes a first and second semiconductor chip. The first semiconductor chip has a first connection structure that electrically connects to a bond pad on a first surface of the first semiconductor chip. The second semiconductor chip has a second connection structure. |
| 7015590 |
Reinforced solder bump structure and method for forming a reinforced solder bump |
March 21, 2006 |
| A reinforced solder bump connector structure is formed between a contact pad arranged on a semiconductor chip and a ball pad arranged on a mounting substrate. The semiconductor chip includes at least one reinforcing protrusion extending upwardly from a surface of an intermediate laye |
