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Tatsuki Ishii Patents
Inventor:
Ishii; Tatsuki
Address:
Nakai, JP
No. of patents:
8
Patents:




Patent Number Title Of Patent Date Issued
7013443 Delay diagnosis method for semiconductor integrated circuit, computer program product for diagno March 14, 2006
A delay diagnosis method is proposed that can avoid design steps from being retraced or repeated uselessly due to defective delay when we design a semiconductor integrated circuit including a plurality of blocks. This delay diagnosis method has the steps of inputting logic informatio
6944840 Design method and system for achieving a minimum machine cycle for semiconductor integrated circ September 13, 2005
Each flip-flop-to-flip-flop path delay and a target machine cycle obtained in the stages of physical design and packaging design are used as input, and with respect to a path in which the path delay is not less than the target machine cycle, a closed loop including the path is extracted,
5544068 System and method for optimizing delays in semiconductor circuits August 6, 1996
A control device and a storage device are provided. The storage device has a clock signal file for determining a delay reference value for a path, and a logic information file for holding description of elements in the path. The control device refers to the clock signal file and the logi
5475611 Circuit structure, semiconductor integrated circuit and path routing method and apparatus theref December 12, 1995
An interconnection path layout in a circuit structure having terminals arranged in rows, such as a semiconductor integrated circuit. Paths are first assigned to selected obstruction-free terminal pairs to be interconnected, and then bypasses are assigned to the remaining obstruction-
5264390 Method of automatic wiring in a semiconductor device November 23, 1993
A method of automatic wiring in a semiconductor integrated circuit device having four or more wiring layers, with the lowest layer being a terminal layer, is intended to overcome the prior art problem in which lower layers are mostly used for wiring and upper layers are not used efficien
5231589 Input/output pin assignment method July 27, 1993
For signal lines to be connected from an LSI device or a module including a plurality of LSI devices as a mounted part via input/output pins thereof to external devices, pin assignment positions are determined as follows. The signal lines are classified into groups depending on attribute
5212107 Wiring method for semiconductor integrated circuits May 18, 1993
A novel wiring method for multilayered semiconductor integrated circuits is disclosed. For example, a semiconductor integrated circuit of a 6-layered wiring structure can be formed with a first layer covered with gates, a second layer, a third layer, a fourth layer and a fifth layer maki
4805113 Method of updating layout of circuit element February 14, 1989
For the purpose of satisfying placement constraint prescribed by design rule data, a region to which a plurality of circuit elements appertain is displayed in such a way that this region is moved to such a position as to environ a part of the circuit elements and at the same time is supe


 
 
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