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Kensaku Ida Patents |
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Inventor: Ida; Kensaku
Address: Wappingers Falls, NY
No. of patents: 3
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7422975 |
Composite inter-level dielectric structure for an integrated circuit |
September 9, 2008 |
| A method is provided for making an inter-level dielectric for a microelectronic device formed on a substrate. The method begins by forming first and second spacer layers over a substrate layer. The spacer layers are formed from a sacrificial dielectric material. Next, first and secon |
| 7265437 |
Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanic |
September 4, 2007 |
| A low k dielectric stack having an effective dielectric constant k, of about 3.0 or less, in which the mechanical properties of the stack are improved by introducing at least one nanolayer into the dielectric stack. The improvement in mechanical properties is achieved without signifi |
| 7202564 |
Advanced low dielectric constant organosilicon plasma chemical vapor deposition films |
April 10, 2007 |
| A porous low k or ultra low k dielectric film comprising atoms of Si, C, O and H (hereinafter "SiCOH") in a covalently bonded tri-dimensional network structure having a dielectric constant of less than about 3.0, a higher degree of crystalline bonding interactions, more carbon as methyl |
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