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Takashi Ichiryu Patents |
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Inventor: Ichiryu; Takashi
Address: Moriguchi, JP
No. of patents: 4
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7321496 |
Flexible substrate, multilayer flexible substrate and process for producing the same |
January 22, 2008 |
| A flexible substrate comprises: a film; an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the |
| 7258549 |
Connection member and mount assembly and production method of the same |
August 21, 2007 |
| A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from |
| 7242823 |
Optical transmission channel board, board with built-in optical transmission channel, and data p |
July 10, 2007 |
| An optical transmission board is provided. The optical transmission board includes an optical transmission channel, a retention board for retaining the optical transmission channel and circuit patterns. The circuit patterns are formed on the retention board and a part of the circuit |
| 7205483 |
Flexible substrate having interlaminar junctions, and process for producing the same |
April 17, 2007 |
| A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second |
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