| Patent Number |
Title Of Patent |
Date Issued |
| 7408191 |
Luminescent device and process of manufacturing the same |
August 5, 2008 |
| In the case where a material containing an alkaline metal or an alkaline-earth metal in a cathode, an anode, a buffer layer, or an organic compound layer is used, there is a fear of the diffusion of an impurity ion (representatively, alkaline metal ion or alkaline-earth metal ion) fr |
| 7384828 |
Semiconductor film, semiconductor device and method of their production |
June 10, 2008 |
| A semiconductor film having a crystalline structure is formed by using a metal element that assists the crystallization of the semiconductor film, and the metal element remaining in the film is effectively removed to decrease the dispersion among the elements. The semiconductor film or, |
| 7368335 |
Semiconductor device and method of manufacturing the same |
May 6, 2008 |
| The orientation ratio of a crystalline semiconductor film obtained by crystallizing an amorphous semiconductor film through heat treatment and irradiation of intense light such as laser light, ultraviolet rays, or infrared rays is enhanced, and a semiconductor device whose active region |
| 7316947 |
Method of manufacturing a semiconductor device |
January 8, 2008 |
| An object is to reduce the number of high temperature (equal to or greater than 600.degree. C.) heat treatment process steps and achieve lower temperature (equal to or less than 600.degree. C.) processes, and to simplify the process steps and increase throughput in a method of manufa |
| 7306982 |
Method of manufacturing a semiconductor device |
December 11, 2007 |
| It is intended to achieve the reduction in number of heat treatments carried out at high temperature (at least 600.degree. C.) and the employment of lower temperature processes (600.degree. C. or lower), and to achieve step simplification and throughput improvement. In the present in |
| 7223446 |
Plasma CVD apparatus and dry cleaning method of the same |
May 29, 2007 |
| In a parallel flat plate type plasma CVD apparatus, plasma damage of constituent parts in a reaction chamber due to irregularity of dry cleaning in the reaction chamber is reduced and the cost is lowered. In the parallel flat plate type plasma CVD apparatus in which high frequency vo |
| 7220613 |
Manufacturing method for semiconductor device |
May 22, 2007 |
| The present invention is provided in order to remove contamination due to contaminant impurities of the interfaces of each film which forms a TFT, which is the major factor that reduces the reliability of TFTs. By connecting a washing chamber and a film formation chamber, film formation |
| 7208394 |
Method of manufacturing a semiconductor device with a fluorine concentration |
April 24, 2007 |
| At present, a forming process of a base film through an amorphous silicon film is conducted in respective film forming chambers in order to obtain satisfactory films. When continuous formation of the base film through the amorphous silicon film is performed in a single film forming chamb |
| 7199027 |
Method of manufacturing a semiconductor film by plasma CVD using a noble gas and nitrogen |
April 3, 2007 |
| There is provided a technique for effectively removing a metallic element for promoting crystallization in a semiconductor film with a crystalline structure after the semiconductor film is obtained using the metallic element, to reduce a variation between elements. In a step of forming a |
| 7169689 |
Method of manufacturing a semiconductor device |
January 30, 2007 |
| Contamination of an interface of respective films constituting a TFT due to an contaminant impurity in a clean room atmosphere becomes a great factor to lower the reliability of the TFT. Besides, when an impurity is added to a crystalline semiconductor film, its crystal structure is |
| 7109074 |
Method of manufacturing a semiconductor device |
September 19, 2006 |
| A technique of reducing fluctuation between elements is provided in which a semiconductor film having a crystal structure is obtained by using a metal element that accelerates crystallization of a semiconductor film and then the metal element remaining in the film is removed effectively. |
| 7034337 |
Semiconductor device and method of manufacturing the same |
April 25, 2006 |
| The orientation ratio of a crystalline semiconductor film obtained by crystallizing an amorphous semiconductor film through heat treatment and irradiation of intense light such as laser light, ultraviolet rays, or infrared rays is enhanced, and a semiconductor device whose active region |
| 6875674 |
Method of manufacturing a semiconductor device with fluorine concentration |
April 5, 2005 |
| At present, a forming process of a base film through an amorphous silicon film is conducted in respective film forming chambers in order to obtain satisfactory films. When continuous formation of the base film through the amorphous silicon film is performed in a single film forming chamb |
| 6867077 |
Semiconductor device and method of manufacturing the same |
March 15, 2005 |
| A barrier layer that meets three requirements, "withstand well against etching and protect a semiconductor film from an etchant as an etching stopper", "allow impurities to move in itself during heat treatment for gettering", and "have excellent reproducibility", is formed and used to |
| 6821828 |
Method of manufacturing a semiconductor device |
November 23, 2004 |
| A technique of reducing fluctuation between elements is provided in which a semiconductor film having a crystal structure is obtained by using a metal element that accelerates crystallization of a semiconductor film and then the metal element remaining in the film is removed effectively. |
| 6808968 |
Method of manufacturing a semiconductor device |
October 26, 2004 |
| It is intended to achieve the reduction in number of heat treatments carried out at high temperature (at least 600.degree. C.) and the employment of lower temperature processes (600.degree. C. or lower), and to achieve step simplification and throughput improvement. In the present in |
| 6794229 |
Manufacturing method for semiconductor device |
September 21, 2004 |
| The present invention is provided in order to remove contamination due to contaminant impurities of the interfaces of each film which forms a TFT, which is the major factor that reduces the reliability of TFTs. By connecting a washing chamber and a film formation chamber, film formation |
| 6743700 |
Semiconductor film, semiconductor device and method of their production |
June 1, 2004 |
| A semiconductor film having a crystalline structure is formed by using a metal element that assists the crystallization of the semiconductor film, and the metal element remaining in the film is effectively removed to decrease the dispersion among the elements. The semiconductor film or, |
| 6717181 |
Luminescent device having thin film transistor |
April 6, 2004 |
| In the case where a material containing an alkaline metal or an alkaline-earth metal in a cathode, an anode, a buffer layer, or an organic compound layer is used, there is a fear of the diffusion of an impurity ion (representatively, alkaline metal ion or alkaline-earth metal ion) fr |
| 6703265 |
Semiconductor device and method of manufacturing the same |
March 9, 2004 |
| The orientation ratio of a crystalline semiconductor film obtained by crystallizing an amorphous semiconductor film through heat treatment and irradiation of intense light such as laser light, ultraviolet rays, or infrared rays is enhanced, and a semiconductor device whose active region |
| 6675816 |
Plasma CVD apparatus and dry cleaning method of the same |
January 13, 2004 |
| In a parallel flat plate type plasma CVD apparatus, plasma damage of constituent parts in a reaction chamber due to irregularity of dry cleaning in the reaction chamber is reduced and the cost is lowered. In the parallel flat plate type plasma CVD apparatus in which high frequency vo |
| 6506636 |
Method of manufacturing a semiconductor device having a crystallized amorphous silicon film |
January 14, 2003 |
| Contamination of an interface of respective films constituting a TFT due to an contaminant impurity in a clean room atmosphere becomes a great factor to lower the reliability of the TFT. Besides, when an impurity is added to a crystalline semiconductor film, its crystal structure is brok |
| 5330578 |
Plasma treatment apparatus |
July 19, 1994 |
| A plasma gaseous reaction apparatus including a reaction chamber, a system for supplying reaction gas to the reaction chamber and an exhaust system for exhausting unnecessary reaction products. Specifically, the apparatus includes a pair of facing electrodes disposed in the reaction cham |