| Patent Number |
Title Of Patent |
Date Issued |
| 6102275 |
Bond head having dual axes of motion |
August 15, 2000 |
| A bond head is provided for a wire bonding machine having a linear axis frame, a rotary axis frame, a bond tool and a wire clamp. The linear axis frame is vertically linearly displacable along a linear axis, while the rotary axis frame is rotationally displacable along a rotary axis. A |
| 6068171 |
Wire conveyance system having a contactless wire slacking device |
May 30, 2000 |
| A wire conveyance system is provided for a wire bonding machine having, in series, a first wire handler, a wire slacking device and a second wire handler. The wire slacking device includes a wire support chamber having a substantially enclosed bottom, opposing first and second vertical |
| 5603445 |
Ultrasonic wire bonder and transducer improvements |
February 18, 1997 |
| Improved ultrasonic wire bonders, and improvements to ultrasonic wire bonding transducers that are used with such ultrasonic wire bonders. The improvements to the ultrasonic wire bonding transducer includes driver-node mounting of the transducer and a clamping arrangement for a bondi |
| 5138127 |
Pressure welding with closed loop force control |
August 11, 1992 |
| A parallel-gap welder applies a precisely controlled force to the weld head (40) by means of a solenoid (60) having a plunger (72) aligned with the axis of the welding electrodes (50,52). To precisely control the amount of force applied by the solenoid a load cell (80) is interposed betw |
| 5115111 |
Dual tip rotating welding electrode |
May 19, 1992 |
| Two parallel elongated closely spaced electrodes for welding electronic circuit components are mounted for limited rotation about an axis extending generally longitudinally of the electrodes to allow the electrode pair to be oriented with respect to a workpiece without angularly movi |
| 5091825 |
Orthogonal bonding method and equipment |
February 25, 1992 |
| Wire bonds are closely spaced about the edge of a semiconductor chip device (150) in an orthogonal array. Even though the wires may have a fan out pattern to their second bond locations, close spacing of the first bond pads is achieved by use of rectangular pads (154) having their long |
| 4940875 |
Force limiting weld head |
July 10, 1990 |
| A force limiting weld head (11) which includes a supporting structure (13), a pressure barrel (15) and an output member (17) mounted for movement on the supporting structure, a fixed electrode (19) mounted on the supporting structure, a movable electrode (21) driven by the output member, |
| 4939978 |
Ammunition chuting for a machine gun |
July 10, 1990 |
| A flexible ammunition chuting (14) for a machine gun (10) includes a flexible spine (26) made up of spring steel strips (27, 29) which are anchored at two spaced and fixed positions, typically at the chuting ends, so as precisely to define the length of the chuting. The chuting includes |
| 4858819 |
Orthogonal bonding method and equipment |
August 22, 1989 |
| Wire bonds are closely spaced about the edge of a semiconductor chip device (150) in an orthogonal array. Even though the wires may have a fan out pattern to their second bond locations, close spacing of the first bond pads is achieved by use of rectangular pads (154) having their long |
| 4718591 |
Wire bonder with open center of motion |
January 12, 1988 |
| A movable open center mounting for the tool of an ultrasonic wire bonding machine employs ball-bearing rollers (22, 24, 30, 32) to permit limited motion of the wire bonding tip (13a) substantially constrained to a vertical line with a minimum of tip skid. The mounting structure which is |
| 4639325 |
Detergent builder |
January 27, 1987 |
| Products which are useful as detergent builders and which do not contain nitrogen or phosphorous atoms are described. Such detergent builders comprise one or more compounds of the Formula I-V below:orwherein M is a salt-forming cation or hydrogen or mixtures thereof. Such compounds and/o |
| 4600138 |
Bonding tool and clamp assembly and wire handling method |
July 15, 1986 |
| A bonding tool and clamp assembly is disclosed and includes an upper wire guide (23,51) and a bonding tool (17,75) having a short guide hole (45) adjacent the heel of the bonding tool foot (41). The bonding tool tip (17a) includes a clamping surface (47) adjacent the guide hole (45); and |
| 4598853 |
Open-center flexural pivot wire bonding head |
July 8, 1986 |
| A flexural pivot structure useful in a wire bonding machine bonding head (10) is disclosed and includes first and second leaf spring assemblies (39,41) which provide a pivot axis (PA) displaced from the pivoting structure. Each leaf spring assembly includes leaf spring arms (39a,39b, |
| 4133742 |
Separation of hydrocarbons from oil shales and tar sands |
January 9, 1979 |
| An efficient and practical process is provided, permitting greatly increased recovery of hydrocarbons from oil shales and tar sands. Steps involved include mixing oil shale or tar sand in water, with pulverized coal, to form an amalgam, and separation of water to be reused in the pro |
| 4012839 |
Method and composition for treating teeth |
March 22, 1977 |
| In the well-known technique of disinfecting caries-infected or potentially caries-infected dental tissue with silver nitrate, silver thiocyanate or its complexes have been substituted for silver nitrate with excellent disinfecting results and lowered side effects, e.g., with lowered toxi |
| 3946110 |
Medicinal compositions and methods of preparing the same |
March 23, 1976 |
| Improvements are set forth in connection with analgesic and antifebritic or antipyretic compositions, tablets with solid medicaments, and methods of preparing such compositions and tablets. Medicament particles, such as aspirin particles, for instance, and pectin or gum particles are inc |
