| Patent Number |
Title Of Patent |
Date Issued |
| 7345885 |
Heat spreader with multiple stacked printed circuit boards |
March 18, 2008 |
| A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein. |
| 7289328 |
Multi-chip module with power system and pass-thru holes |
October 30, 2007 |
| Embodiments include apparatus, methods, and systems having a multi-chip module with a power system and pass-thru holes. An exemplary electronic module includes a first portion having a first printed circuit board (PCB) with a memory and plural processors. A second portion has a power |
| 7230468 |
Systems and methods for providing distributed control signal redundancy among electronic circuit |
June 12, 2007 |
| In one embodiment, a distributed redundant control signal distribution system comprises a first control signal source co-located with a first set of control signal controlled circuit elements, at least one second control signal source co-located with a second set of control signal co |
| 7072185 |
Electronic module for system board with pass-thru holes |
July 4, 2006 |
| Embodiments include apparatus, methods, and systems of an electronic module for a system board having at least one pass-thru hole. An exemplary electronic module, connectable to a system board with a pass-thru hole, includes a first portion coupled to one side of the system board. Th |
| 6825651 |
Test method for characterizing currents associated with powered components in an electronic syst |
November 30, 2004 |
| A test method characterizes current behavior of power components (e.g., semiconductor packages) within an electronic system. One or more electrically conductive loops are formed with a first printed circuit board of the electronic system; these loops surround, at least in part, one o |
| 6818835 |
Processor and power supply circuit |
November 16, 2004 |
| A circuit comprising multiple circuit boards is disclosed herein. An embodiment of the circuit may comprise first and second printed circuit boards. The first printed circuit board may comprise first and second conductive planes. The first conductive plane has a first shape and the s |
| 6596948 |
Processor and power supply circuit |
July 22, 2003 |
| A high performance processor assembly is electrically connected to a power supply so as to minimize voltage variations associated with the supply of power to the processor assembly. The processor assembly is fabricated on a multilayered printed circuit board. Power is supplied to compone |
