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Randy L. German Patents |
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Inventor: German; Randy L.
Address: Austin, TX
No. of patents: 3
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 5830533 |
Selective patterning of metallization on a dielectric substrate |
November 3, 1998 |
| A method of selectively fabricating metallization on a dielectric substrate is disclosed. A seed layer is sputtered on a polymer dielectric, a patterned photoresist mask is disposed over the seed layer, exposed portions of the seed layer are etched, the photoresist is stripped, and c |
| 5508228 |
Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and |
April 16, 1996 |
| Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The p |
| 5116463 |
Detecting completion of electroless via fill |
May 26, 1992 |
| A method for detecting the completion of electrolessly depositing metal into a via. The method includes providing a non-autocatalytic detection mask with an opening over a via containing an autocatalytic material, electrolessly depositing a conductive metal into the via which fails to |
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