| Patent Number |
Title Of Patent |
Date Issued |
| 7291901 |
Packaging method, packaging structure and package substrate for electronic parts |
November 6, 2007 |
| A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrate |
| 7268002 |
Packaging method, packaging structure and package substrate for electronic parts |
September 11, 2007 |
| A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrate |
| 7260806 |
Printed wiring board design aiding apparatus, printed wiring board design aiding method, and pri |
August 21, 2007 |
| The present invention provides a printed wiring board design aiding apparatus, method, and program that can easily and inexpensively predict the displacement of a printed wiring board of complicated shape and configuration due to temperature change. The printed wiring board design ai |
| 7222316 |
Board design aiding apparatus, board design aiding method and board design aiding program |
May 22, 2007 |
| A board design aiding apparatus that simplifies a designed printed wiring board to predict a displacement quantity of the printed wiring board includes a layer thickness calculation section 21 for obtaining a mean thickness of an area of a board by a prescribed rule for an essential |
| 7053493 |
Semiconductor device having stiffener |
May 30, 2006 |
| A semiconductor device including a substrate, a semiconductor element mounted on the substrate and a stiffener attached via an adhesive to a surface of the substrate opposite a surface thereof on which the semiconductor element is mounted. The adhesive has a coefficient of thermal ex |
| 6869822 |
Method of making a semiconductor device with adhesive sealing subjected to two-fold hardening |
March 22, 2005 |
| According to a method of making a semiconductor device, a semiconductor chip is bonded to a substrate via bumps by flip-chip bonding. Then, a sealing adhesive composition is loaded between the semiconductor chip and the substrate to provide an adhesive sealing. The sealing adhesive c |
