| Patent Number |
Title Of Patent |
Date Issued |
| 7387944 |
Method for low temperature bonding and bonded structure |
June 17, 2008 |
| A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. One etching process The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperatur |
| 7335572 |
Method for low temperature bonding and bonded structure |
February 26, 2008 |
| A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperature chemical bondi |
| 7041178 |
Method for low temperature bonding and bonded structure |
May 9, 2006 |
| A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperature chemical bondi |
| 6902987 |
Method for low temperature bonding and bonded structure |
June 7, 2005 |
| A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. One etching process the method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperatur |
| 6822326 |
Wafer bonding hermetic encapsulation |
November 23, 2004 |
| A method for providing encapsulation of an electronic device which obtains an encapsulating member configured to enclose the electronic device, prepares a surface of the encapsulating member for non-adhesive direct bonding, prepares a surface of a device carrier including the electronic |
