| Patent Number |
Title Of Patent |
Date Issued |
| 6798650 |
Disk drive bracket |
September 28, 2004 |
| A bracket having two parallel sides and an interconnecting crosspiece is attached to a disk drive or similar peripheral with the sides of the bracket extending longitudinally of the sides of the drive and the crosspiece extending across the front of the drive. A chassis of a computer |
| 6502628 |
Method and apparatus for undirectional coolant flow control unit for pressurized cooling systems |
January 7, 2003 |
| The present invention is a method and apparatus for unidirectional coolant flow control unit for pressurized cooling systems. The invention comprises a valve on a coolant flow control unit. The valve remains in the open position during normal function of the coolant flow control unit. If |
| 6378965 |
Disk drive bracket |
April 30, 2002 |
| A bracket having two parallel sides and an interconnecting crosspiece is attached to a disk drive or similar peripheral with the sides of the bracket extending longitudinally of the sides of the drive and the crosspiece extending across the front of the drive. A chassis of a computer |
| 6081028 |
Thermal management enhancements for cavity packages |
June 27, 2000 |
| A thermal conducting material for providing lateral thermal conduction across a surface of an integrated circuit and for enhancing thermal dissipation from the integrated circuit. The integrated circuit is incorporated within a semiconductor device having a cavity package. A layer of |
| 6067225 |
Disk drive bracket |
May 23, 2000 |
| A bracket having two parallel sides and an interconnecting crosspiece is attached to a disk drive or similar peripheral with the sides of the bracket extending longitudinally of the sides of the drive and the crosspiece extending across the front of the drive. A chassis of a computer |
| 5972736 |
Integrated circuit package and method |
October 26, 1999 |
| An integrated circuit package with heat slug is disclosed. The heat slug is thermally coupled to one or more semiconductor die using a single layer of high conductivity adhesive. The assembly process of this invention includes the steps of initially attaching a temporary heat slug to the |
| 5329993 |
Integral heat pipe, heat exchanger and clamping plate |
July 19, 1994 |
| An integral heat pipe, heat exchanger, and clamping plate. A base plate functioning as an evaporator has disposed in it a multiplicity of intersecting parallel and perpendicular internal channels extending laterally substantially across the base plate. A sintered copper thermal wick |
| 5280409 |
Heat sink and cover for tab integrated circuits |
January 18, 1994 |
| An apparatus providing a heat sink and protective cover for a Tape Automated Bonding ("TAB") integrated circuit mounted on a printed circuit board. The apparatus is comprised of a printed circuit board with a plurality of thermal vias drilled through it. The TAB integrated circuit is |
| 5253702 |
Integral heat pipe, heat exchanger, and clamping plate |
October 19, 1993 |
| An integral heat pipe, heat exchanger, and clamping plate. A base plate functioning as an evaporator has disposed in it a multiplicity of intersecting parallel and perpendicular internal channels extending laterally substantially across the base plate. A sintered copper thermal wick |
| 5216580 |
Optimized integral heat pipe and electronic circuit module arrangement |
June 1, 1993 |
| An optimized integral heat pipe and electronic circuit module arrangement is described. A ceramic multi-chip module bearing electronic circuit components has applied to the side opposite the electronic circuit components preparatory metallization and a thermal wick. A heat pipe evapo |
