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Timothy S. Dyer Patents
Inventor:
Dyer; Timothy S.
Address:
Auburn, CA
No. of patents:
20
Patents:




Patent Number Title Of Patent Date Issued
7368741 Extreme ultraviolet light source May 6, 2008
The present invention provides a reliable, high-repetition rate, production line compatible high energy photon source. A very hot plasma containing an active material is produced in vacuum chamber. The active material is an atomic element having an emission line within a desired extr
7366219 Line narrowing module April 29, 2008
A line narrowing method and module for a narrow band DUV high power high repetition rate gas discharge laser producing output laser light pulse beam pulses in bursts of pulses, the module having a nominal optical path are disclosed which may comprise: a dispersive center wavelength s
7339973 Electrodes for fluorine gas discharge lasers March 4, 2008
Fluorine gas discharge laser electrodes and electrode systems that may comprise a plurality of current return tangs extending for less than the respective length of the second elongated gas discharge electrode. In addition electrodes may comprise a first discharge shaping magnet mounted
7301980 Halogen gas discharge laser electrodes November 27, 2007
A gas discharge laser includes a laser chamber containing a halogen laser gas, two electrode elements defining a cathode and an anode, each having a discharge receiving region defining two longitudinal edges and having a region width defining a width of an electric discharge between the
7230965 Anodes for fluorine gas discharge lasers June 12, 2007
Electrodes for a fluorine gas discharge laser are disclosed which may comprise a crown straddling the centerline axis between the pair of side walls and the pair of end walls, comprising a first material, forming at least a portion of the discharge region of the electrode; the crown in
7229343 Orbiting indexable belt polishing station for chemical mechanical polishing June 12, 2007
An apparatus for planarizing a workpiece has a web with a face which is positioned adjacent the workpiece during planarization. At least one tension assembly is configured to maintain tension of the web. An orbiting assembly is configured to orbit the web relative to the workpiece. T
7193228 EUV light source optical elements March 20, 2007
Apparatus and methods are disclosed for forming plasma generated EUV light source optical elements, e.g., reflectors comprising MLM stacks employing various binary layer materials and capping layer(s) including single and binary capping layers for utilization in plasma generated EUV ligh
7132123 High rep-rate laser with improved electrodes November 7, 2006
The present invention provides a gas discharge laser having at least one long-life elongated electrode for producing at least 12 billion high voltage electric discharges in a fluorine containing laser gas. In a preferred embodiment at least one of the electrodes is comprised of a fir
7095774 Cathodes for fluorine gas discharge lasers August 22, 2006
A fluorine gas discharge laser electrode for a gas discharge laser having a laser gas containing fluorine and a method for manufacturing an electrode is disclosed. The electrode may include a copper and copper alloy body having an upper curved region containing a discharge footprint
6972421 Extreme ultraviolet light source December 6, 2005
The present invention provides a reliable, high-repetition rate, production line compatible high energy photon source. A very hot plasma containing an active material is produced in vacuum chamber. The active material is an atomic element having an emission line within a desired extreme
6937635 High rep-rate laser with improved electrodes August 30, 2005
The present invention provides a gas discharge laser having at least one long-life elongated electrode for producing at least 12 billion high voltage electric discharges in a fluorine containing laser gas. In a preferred embodiment at least one of the electrodes is comprised of a fir
6793565 Orbiting indexable belt polishing station for chemical mechanical polishing September 21, 2004
An apparatus for planarizing a workpiece has a web with a face which is positioned adjacent the workpiece during planarization. At least one tension assembly is configured to maintain tension of the web. An orbiting assembly is configured to orbit the web relative to the workpiece.In ano
6690706 High rep-rate laser with improved electrodes February 10, 2004
The present invention provides a gas discharge laser having at least one long-life elongated electrode for producing at least 12 billion high voltage electric discharges in a fluorine containing laser gas. In a preferred embodiment at least one of the electrodes is comprised of a fir
6661826 Laser chamber insulator with sealed electrode feedthrough December 9, 2003
A feedthrough structure of a gas discharge laser chamber conducts electric power through the wall of a sealed gas enclosure to a single piece elongated electrode inside the enclosure. The feedthrough structure includes a single piece integrated main insulator larger than the electrod
6652366 Dynamic slurry distribution control for CMP November 25, 2003
The invention is a slurry distribution system for controlling the distribution of slurry across a top surface of a polishing pad. The polishing pad may be supported by a platen and be part of a polishing station in a chemical mechanical polishing tool. Two juxtaposed perforated manif
6540592 Carrier head with reduced moment wear ring April 1, 2003
A work piece carrier head for a CMP or other polishing apparatus is configured to eliminate the slow band associated with the polishing of the surface of a work piece. The carrier head includes a wear ring that is positioned circumferentially about the work piece and that together with
6447368 Carriers with concentric balloons supporting a diaphragm September 10, 2002
The invention is a chemical-mechanical polishing wafer carrier that is able to apply a plurality of different pressures, with minimal discontinuities at the interfaces between different pressures, through a diaphragm to a back surface of a wafer. A plurality of concentric balloons, that
6409580 Rigid polishing pad conditioner for chemical mechanical polishing tool June 25, 2002
The present invention is a method and apparatus for conditioning a polishing pad used for chemically mechanically polishing semiconductor wafers. The conditioning device includes a rigid elongated element that resists bowing or warping during the conditioning process. Abrasive elemen
6288357 Ion milling planarization of semiconductor workpieces September 11, 2001
A method and apparatus is presented for planarizing or polishing workpiece surfaces using an ion beam in the presence of a radio frequency generated plasma. A workpiece is placed in a holder within a vacuum chamber equipped with a radio frequency inductive plasma generator. The workpiece
6203417 Chemical mechanical polishing tool components with improved corrosion resistance March 20, 2001
Components of chemical, mechanical, polishing apparatus with components resistant to chemical attack by chemical slurries used in the polishing of semiconductor wafers. Among the components that are improved to enhance resistance to chemical attack are the polishing platen, pad condition


 
 
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