| Patent Number |
Title Of Patent |
Date Issued |
| 7442045 |
Miniature electrical ball and tube socket with self-capturing multiple-contact-point coupling |
October 28, 2008 |
| A socket connector for connecting a bulbous terminal or ball wherein the female element grips the terminal with resilient prongs with end tips at low insertion force but positive contact is maintained and wherein attempted withdrawal is normally inhibited by increasing force applied to |
| 7393214 |
High performance electrical connector |
July 1, 2008 |
| A socket connector for connecting a post or ball wherein the female element grips the post with resilient prongs with end tips at low insertion force but positive contact is maintained and wherein attempted withdrawal is normally inhibited by increasing force applied to the post by t |
| 7382143 |
Wafer probe interconnect system |
June 3, 2008 |
| A wafer probe interconnect apparatus for use in testing a plurality of uncut chips in a semiconductor wafer. The apparatus includes a support block and a dielectric substrate coupled to the support block and supported on a patterned array of posts to inhibit displacement of the diele |
| 7368818 |
Methods of making microelectronic assemblies including compliant interfaces |
May 6, 2008 |
| An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The |
| 7291910 |
Semiconductor chip assemblies, methods of making same and components for same |
November 6, 2007 |
| Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensate for thermal exp |
| 7272888 |
Method of fabricating semiconductor chip assemblies |
September 25, 2007 |
| A method of making a microelectronic package includes providing a first microelectronic element having electrically conductive parts and including first and second surfaces and providing a compliant element including a releasable adhesive over the first surface of the first microelec |
| 7271481 |
Microelectronic component and assembly having leads with offset portions |
September 18, 2007 |
| A microelectronic component comprising a dielectric layer having an opening and leads extending across the opening is disclosed. The leads have an offset portion. A method of making a microelectronic assembly comprises connecting each of the leads to a contact on a microelectronic el |
| 7198969 |
Semiconductor chip assemblies, methods of making same and components for same |
April 3, 2007 |
| Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensate for thermal exp |
| 7166914 |
Semiconductor package with heat sink |
January 23, 2007 |
| A packaged semiconductor chip including the chip, and a package element such as a heat sink is made by connecting flexible leads between contacts on the chip and terminals on a dielectric element such as a sheet or plate and moving the sheet or plate away from the chip, and injecting a |
| 7166326 |
Method of electroplating stressed metal springs |
January 23, 2007 |
| A novel method of forming a released metal spring structure is described. In the method, a release layer including a blowing agent is deposited, usually printed, over portions of a substrate. A metal film is deposited over both the release layer and the substrate. The release layer is th |
| 7159308 |
Method of making a circuit board |
January 9, 2007 |
| Provided is a method of forming a circuit board including (a) providing a first conductive sheet; (b) selectively removing one or more portions of the first conductive sheet to form a first panel having a first circuit board that is coupled to a disposable part of the first panel by at l |
| 7152311 |
Enhancements in framed sheet processing |
December 26, 2006 |
| A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-tra |
| 7121859 |
Flexible cable interconnect assembly |
October 17, 2006 |
| A data transmission interconnect assembly capable of transmission speeds in excess of 40 Gbps in which, for example, a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and conne |
| 7098078 |
Microelectronic component and assembly having leads with offset portions |
August 29, 2006 |
| A microelectronic component comprising a dielectric layer having an opening and leads extending across the opening is disclosed. The leads have an offset portion. A method of making a microelectronic assembly comprises connecting each of the leads to a contact on a microelectronic el |
| 7078819 |
Microelectronic packages with elongated solder interconnections |
July 18, 2006 |
| A soldered assembly for a microelectronic element includes a microelectronic element, solder columns extending from a surface of the microelectronic element and terminals connected to distal ends of the columns. The assembly can be handled and mounted using conventional surface-mount |
| 7067742 |
Connection component with peelable leads |
June 27, 2006 |
| A connection component for use in making microelectronic element assemblies which has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to t |
| 7002081 |
Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method |
February 21, 2006 |
| A circuit board layer 2 in accordance with the present invention includes a conductive sheet 4 sandwiched between an insulating top layer 10 and an insulating bottom layer 14. The top and bottom layers 10 and 14 and the conductive sheet 4 define the circuit board layer 2 having an edge t |
| 6998703 |
Thin package for stacking integrated circuits |
February 14, 2006 |
| An improved structure and method for making interconnects for a thin package of stacked integrated circuits is described. The structure uses a spring contact to replace traditional solder balls in a stacked structure. The spring contacts are incorporated in an integrated circuit laye |
| 6978538 |
Method for making a microelectronic interposer |
December 27, 2005 |
| A microelectronic interposer is made by providing a sacrificial layer over the surface of a planar body. Apertures are formed passing through the body and the sacrificial layer. A layer of an electrically conductive structural material is deposited in each of the apertures and over the |
| 6966784 |
Flexible cable interconnect assembly |
November 22, 2005 |
| A data transmission interconnect assembly (e.g., a router) capable of transmission speeds in excess of 40 Gbps in which a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and co |
| 6938338 |
Method of making an electronic contact |
September 6, 2005 |
| Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a |
| 6897090 |
Method of making a compliant integrated circuit package |
May 24, 2005 |
| A component incorporating a dielectric element such as a polymeric film with leads and terminals thereon is assembled with a semiconductor chip and bond regions of the leads are connected to contacts of the chip. At least one lead incorporates a plural set of connecting regions connectin |
| 6888229 |
Connection components with frangible leads and bus |
May 3, 2005 |
| A semiconductor chip mounting component includes a support structure adapted to engage a semiconductor chip. The support structure has a top surface, a bottom surface, and a gap extending through the support structure for defining first and second portions of the support structure on |
| 6844504 |
Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method |
January 18, 2005 |
| A circuit board layer 2 in accordance with the present invention includes a conductive sheet 4 sandwiched between an insulating top layer 10 and an insulating bottom layer 14. The top and bottom layers 10 and 14 and the conductive sheet 4 define the circuit board layer 2 having an edge t |
| 6780747 |
Methods for providing void-free layers for semiconductor assemblies |
August 24, 2004 |
| A method of providing a substantially void free layer for one or more flip chip assemblies, or one or more microelectronic components, utilizing a curable encapsulant. Also disclosed is a method of injecting an encapsulant into an assembly and a method of treating a microelectronic c |
| 6771084 |
Single-sided compliant probe apparatus |
August 3, 2004 |
| A small single-sided compliant probe is provided that includes a conductive tip, which is positioned on a supporting surface in a manner that allows a tip on the probe to move flexibly with respect to the supporting surface in close proximity to adjacent probes in an array. The probe tip |
| 6709895 |
Packaged microelectronic elements with enhanced thermal conduction |
March 23, 2004 |
| A semiconductor chip is mounted in face-up disposition on a dielectric element, with thermally conductive but flexible elements disposed between the chip bottom surface and the top surface of the dielectric element so as to provide a compliant but thermally conductive path from the chip |
| 6706973 |
Electrical connection with inwardly deformable contacts |
March 16, 2004 |
| An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact extends from a central conductor, and has a peripheral portion adapted to contract radially inwardly toward the central conductor response to a force applied by a conta |
| 6700072 |
Electrical connection with inwardly deformable contacts |
March 2, 2004 |
| An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact extends from a central conductor, and has a peripheral portion adapted to contract radially inwardly toward the central conductor response to a force applied by a conta |
| 6687842 |
Off-chip signal routing between multiply-connected on-chip electronic elements via external mult |
February 3, 2004 |
| A semiconductor chip is provided with a dielectric element having conductive features interconnecting electronic elements within the chip with one another. The conductive features replace internal conductors, and can provide enhanced signal propagation between elements of the chip. The |
| 6653172 |
Methods for providing void-free layers for semiconductor assemblies |
November 25, 2003 |
| A method of treating an interposer layer includes disposing an interposer layer between a semiconductor wafer and a substrate so that voids within the interposer layer are sealed and applying pressure to substantially eliminate the voids. A method of creating a substantially void-free |
| 6635553 |
Microelectronic assemblies with multiple leads |
October 21, 2003 |
| A microelectronic connection component includes a support such as a dielectric sheet having elongated leads extending along a surface. The leads have terminal ends permanently connected to the support and tip ends releasably connected to the support. The support is juxtaposed with a |
| 6617865 |
Compliant probe apparatus |
September 9, 2003 |
| A mechanically compliant probe for electrically connecting to contact pads on microelectronic devices. The probe is used for burn-in of integrated circuits at the wafer level. Additional applications include probe cards for testing integrated circuits and sockets for flip-chips. One embo |
| 6603209 |
Compliant integrated circuit package |
August 5, 2003 |
| The present invention provides a method for fabricating a compliant microelectronic device package and an associated apparatus for substantially obviating thermal, compliancy and interconnection problems. Flexible, dielectric layers are used having on a first surface a plurality cond |
| 6541874 |
Encapsulation of microelectronic assemblies |
April 1, 2003 |
| Microelectronic assemblies are encapsulated using disposable frames. The microelectronic assemblies are disposed within an aperture defined by a frame. The aperture is covered by top and bottom sealing layers so that the frame and sealing layers define an enclosed space encompassing the |
| 6541852 |
Framed sheets |
April 1, 2003 |
| A microelectronic component is fabricated by bonding a flexible sheet in tension on a rigid frame so that the sheet spans an aperture in the frame, and performing one or more operations on features on the flexible sheet which will be incorporated into the finished component. The frame |
| 6541845 |
Components with releasable leads and methods of making releasable leads |
April 1, 2003 |
| A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchor |
| 6468836 |
Laterally situated stress/strain relieving lead for a semiconductor chip package |
October 22, 2002 |
| A semiconductor chip package having an internal laterally curved lead in order to compensate for the CTE mismatch between a semiconductor chip and a supporting substrate, such as a PWB. |
| 6465893 |
Stacked chip assembly |
October 15, 2002 |
| A semiconductor chip assembly, comprises a first semiconductor chip having a front surface, a rear surface and contacts on the front surface and a second semiconductor chip having a front surface, a rear surface and contacts on the front surface. The rear surface of the second semico |
| 6465747 |
Microelectronic assemblies having solder-wettable pads and conductive elements |
October 15, 2002 |
| A microelectronic assembly includes a component having one or more conductive pads, with each conductive pad having a plurality of solder-wettable strips extending outwardly away from a center, the solder wettable strips being bounded by non solder-wettable material. The microelectro |
| 6460245 |
Method of fabricating semiconductor chip assemblies |
October 8, 2002 |
| A method of making a microelectronic package includes providing a first microelectronic element having electrically conductive parts and including first and second surfaces and providing a compliant element including a releasable adhesive over the first surface of the first microelectron |
| 6458681 |
Method for providing void free layer for semiconductor assemblies |
October 1, 2002 |
| A method of providing a substantially void free layer for one or more flip chip assemblies, or one or more microelectronic components, utilizing a curable encapsulant. Also disclosed is a method of injecting an encapsulant into an assembly and a method of treating a microelectronic c |
| 6458628 |
Methods of encapsulating a semiconductor chip using a settable encapsulant |
October 1, 2002 |
| A method of making a semiconductor chip package by attaching a chip to a dielectric layer; placing the dielectric layer and chip into a mold; disposing a thixotropic composition that has been sheared to reduce its viscosity into the mold and curing the thixotropic composition after the |
| 6433419 |
Face-up semiconductor chip assemblies |
August 13, 2002 |
| A semiconductor chip is mounted in face-up disposition, with a contact-bearing front surface facing away from a substrate such as a circuit panel, and with a rear face facing toward the substrate. A backing element having terminals is disposed between the rear face of the chip and th |
| 6426638 |
Compliant probe apparatus |
July 30, 2002 |
| A mechanically compliant probe for electrically connecting to contact pads on microelectronic devices. The probe is used for burn-in of integrated circuits at the wafer level. Additional applications include probe cards for testing integrated circuits and sockets for flip-chips. One embo |
| 6392306 |
Semiconductor chip assembly with anisotropic conductive adhesive connections |
May 21, 2002 |
| A semiconductor chip assembly including a semiconductor chip having contacts on a front surface, an element having terminals thereon and leads connecting the contacts to the terminals, wherein the leads are connected to the chip contacts by Z-conductive adhesive connections. In a preferr |
| 6388340 |
Compliant semiconductor chip package with fan-out leads and method of making same |
May 14, 2002 |
| A semiconductor chip package, and a method of making such a package, including a flexible dielectric element with a plurality of electrically conductive terminals, an expander ring connected to the flexible dielectric element, a semiconductor chip disposed with a central opening in t |
| 6373141 |
Bondable compliant pads for packaging of a semiconductor chip and method therefor |
April 16, 2002 |
| A microelectronic package comprising a microelectronic element, resilient element including one or more intermediary layers capable of being wetted and assembled with the microelectronic element, and an adhesive is provided. The adhesive contacts at least one of the one or more inter |
| 6372527 |
Methods of making semiconductor chip assemblies |
April 16, 2002 |
| A method of making semiconductor chip assemblies includes providing a semiconductor wafer including a plurality of semiconductor chips having contacts on a contact bearing surface thereof and providing a substrate having a first surface with a plurality of conductive terminals located |
| 6370032 |
Compliant microelectronic mounting device |
April 9, 2002 |
| The present invention provides an interconnection scheme having complaint contacts arranged in an array to connect conductive surfaces on a microelectronic device and a supporting substrate, such as a printed circuit board. This invention accommodates for the difference in thermal co |
