| Patent Number |
Title Of Patent |
Date Issued |
| 7425758 |
Metal core foldover package structures |
September 16, 2008 |
| Chip-scale packages and assemblies thereof and methods of fabricating such packages including Chip-On-Board, Board-On-Chip, and vertically stacked Package-On-Package modules are disclosed. The chip-scale package includes a core member of a metal or alloy having a recess for at least part |
| 7423336 |
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and |
September 9, 2008 |
| A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerou |
| 7408255 |
Assembly for stacked BGA packages |
August 5, 2008 |
| Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the subst |
| 7400032 |
Module assembly for stacked BGA packages |
July 15, 2008 |
| Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the subst |
| 7396702 |
Module assembly and method for stacked BGA packages |
July 8, 2008 |
| Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the subst |
| 7378723 |
Method and apparatus for decoupling conductive portions of a microelectronic device package |
May 27, 2008 |
| A method and apparatus for decoupling conductive portions of a microelectronic device package. In one embodiment, the package can include a microelectronic substrate and a conductive member positioned at least proximate to the microelectronic substrate. The conductive member can have |
| 7375419 |
Stacked mass storage flash memory package |
May 20, 2008 |
| A stacked multiple offset chip device is formed of two or more dice of similar dimensions and bond pad arrangement, in which bond pads are located in fields along less than three edges of the active surface of each die. A first die is attached to a substrate and subsequent die or dic |
| 7372138 |
Routing element for use in multi-chip modules, multi-chip modules including the routing element |
May 13, 2008 |
| A routing element for use in a semiconductor device assembly includes a substrate that carries conductive traces that provide either additional electrical paths or shorter electrical paths than those provided by a carrier substrate of the semiconductor device assembly. The conductive |
| 7372131 |
Routing element for use in semiconductor device assemblies |
May 13, 2008 |
| A routing element for use in a semiconductor device assembly includes a substrate that carries conductive traces that provide either additional electrical paths or shorter electrical paths than those provided by a carrier substrate of the semiconductor device assembly. The conductive |
| 7367845 |
Modular sockets using flexible interconnects |
May 6, 2008 |
| A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable |
| 7365420 |
Semiconductor packages and methods for making and using same |
April 29, 2008 |
| A semiconductor package is provided which includes a substrate having a plurality of semiconductor dice mounted thereon. The substrate is divided into segments by grooves formed in the bottom surface of the substrate. Each semiconductor die is electrically connected to the substrate by |
| 7326591 |
Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates |
February 5, 2008 |
| Substrates for mounting microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices are disclosed herein. A method of manufacturing a substrate in accordance with one embodiment of the invention includes forming a conductive trace |
| 7321160 |
Multi-part lead frame |
January 22, 2008 |
| A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame semiconductor devi |
| 7312516 |
Chip scale package with heat spreader |
December 25, 2007 |
| A dense semiconductor flip-chip device assembly is provided with a heat sink/spreading/dissipating member that is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Semiconductor dice are bonded to the paddles by, e.g., conventional semiconductor die attachment |
| 7291900 |
Lead frame-based semiconductor device packages incorporating at least one land grid array packag |
November 6, 2007 |
| A lead frame-based semiconductor device package including at least one land grid array package. At least one semiconductor die is mounted to an interposer substrate, with bond pads of the semiconductor die connected to terminal pads on the same side of the interposer substrate as the at |
| 7285442 |
Stackable ceramic FBGA for high thermal applications |
October 23, 2007 |
| An apparatus package for high-temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices. |
| 7282805 |
Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting e |
October 16, 2007 |
| A rerouting element for a semiconductor device includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerouting |
| 7282397 |
Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemb |
October 16, 2007 |
| A rerouting element for a semiconductor device includes a substantially planar member that carries at least one contact location, at least one conductive, at least one rerouted bond pad. The contact location is positioned adjacent to a first periphered edge of the substantially plana |
| 7279797 |
Module assembly and method for stacked BGA packages |
October 9, 2007 |
| Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the substantial matchin |
| 7262506 |
Stacked mass storage flash memory package |
August 28, 2007 |
| A stacked multiple offset chip device is formed of two or more dice of similar dimensions and bond pad arrangement, in which bond pads are located in fields along less than three edges of the active surface of each die. A first die is attached to a substrate and subsequent die or dic |
| 7257884 |
Method for fabricating semiconductor component with adjustment circuitry for electrical characte |
August 21, 2007 |
| A semiconductor component includes adjustment circuitry configured to adjust selected physical and electrical characteristics of the component or elements thereof, and an input/output configuration of the component. The component includes a semiconductor die, a substrate attached to the |
| 7239029 |
Packages for semiconductor die |
July 3, 2007 |
| A ball grid array assembly includes a package cover that encapsulates a die and a portion of a substrate to which the die is attached, including an edge of the substrate. Encapsulation of the substrate edge by the cover reduces penetration of moisture or other contaminants into the s |
| 7235871 |
Stacked microelectronic dies |
June 26, 2007 |
| An assembly of microelectronic devices and method for forming an assembly of microelectronic devices. In one embodiment, the method includes positioning a first packaged microelectronic device adjacent to a support member having support member circuitry, with the first packaged micro |
| 7233056 |
Chip scale package with heat spreader |
June 19, 2007 |
| A dense semiconductor flip-chip device assembly is provided with a heat sink/spreading/dissipating member that is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Semiconductor dice are bonded to the paddles by, e.g., conventional semiconductor die attachment |
| 7226813 |
Semiconductor package |
June 5, 2007 |
| A semiconductor package is provided which includes a semiconductor die which is formed in a die mounting area of a substrate. The die mounting area includes a frame with an opening formed therein, a die paddle, and a descending portion which connects the die paddle to the frame. The die |
| 7192311 |
Apparatus for forming modular sockets using flexible interconnects and resulting structures |
March 20, 2007 |
| A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable |
| 7183138 |
Method and apparatus for decoupling conductive portions of a microelectronic device package |
February 27, 2007 |
| A method and apparatus for decoupling conductive portions of a microelectronic device package. In one embodiment, the package can include a microelectronic substrate and a conductive member positioned at least proximate to the microelectronic substrate. The conductive member can have |
| 7153164 |
Method and apparatus for forming modular sockets using flexible interconnects and resulting stru |
December 26, 2006 |
| A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable |
| 7151013 |
Semiconductor package having exposed heat dissipating surface and method of fabrication |
December 19, 2006 |
| A high density semiconductor package with thermally enhanced properties is described. The semiconductor package includes a pair of lead frames, each being attached to a respective semiconductor die. The dies are attached to respective lead frames via an adhering material, such as a tape. |
| 7144245 |
Packages for semiconductor die |
December 5, 2006 |
| A ball grid array assembly includes a package cover that encapsulates a die and a portion of a substrate to which the die is attached, including an edge of the substrate. Encapsulation of the substrate edge by the cover reduces penetration of moisture or other contaminants into the s |
| 7101730 |
Method of manufacturing a stackable ball grid array |
September 5, 2006 |
| A method of manufacturing a stackable package to create a 3-dimensional memory array using ball grid array technology. Specifically, memory chips are coupled to a preformed packages which have alignment features to allow for the stacking of the ball grid arrays. The alignment features |
| 7098527 |
Integrated circuit package electrical enhancement with improved lead frame design |
August 29, 2006 |
| A configuration for a conventional lead frame for conserving limited leads and for allowing the location of bond pads anywhere on the periphery of the semiconductor device and for reducing the cost of tooling changes by permitting the use of current tooling. The present invention utilize |
| 7094631 |
Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemb |
August 22, 2006 |
| A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerou |
| 7094108 |
Apparatus for forming modular sockets using flexible interconnects and resulting structures |
August 22, 2006 |
| A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable |
| 7091060 |
Circuit and substrate encapsulation methods |
August 15, 2006 |
| A ball grid array assembly includes a package cover that encapsulates a die and a portion of a substrate to which the die is attached, including an edge of the substrate. Encapsulation of the substrate edge by the cover reduces penetration of moisture or other contaminants into the s |
| 7084514 |
Multi-chip module and methods |
August 1, 2006 |
| A substrate includes first and second regions over which first and second semiconductor devices are to be respectively positioned. The first region is located at least partially within the second region. Contact areas are located external to the first region but within the second region. |
| 7084490 |
Leads under chip IC package |
August 1, 2006 |
| A semiconductor device assembly including a semiconductor device having a plurality of bond pads on the active surface thereof and a lead frame having a portion of the plurality of lead fingers of the lead frame located below the semiconductor device in a substantially horizontal pla |
| 7082678 |
Method of fabricating an integrated circuit package |
August 1, 2006 |
| A method of forming a semiconductor package is provided. The method includes forming a leadframe wherein the conductors or leads of the leadframe extend from a first end to a second end such that a portion of each lead exhibits a generally arcuate shape. The first end may be coupled |
| 7071542 |
Lead frame decoupling capacitor, semiconductor device packages including the same and methods |
July 4, 2006 |
| A lead frame includes at least two layers, each of which includes an electrically conductive bus and a group of leads that extend substantially unidirectionally from a single edge of the lead frame. The lead fingers of each layer may extend in substantially the same direction. The el |
| 7056771 |
Method of forming an array of semiconductor packages |
June 6, 2006 |
| A semiconductor package is provided which includes a substrate having a plurality of semiconductor dice mounted thereon. The substrate is divided into segments by grooves formed in the bottom surface of the substrate. Each semiconductor die is electrically connected to the substrate by |
| 7055241 |
Method of fabricating an integrated circuit package |
June 6, 2006 |
| A method of forming a semiconductor package is provided. The method includes forming a leadframe wherein the conductors or leads of the leadframe extend from a first end to a second end such that a portion of each lead exhibits a generally arcuate shape. The first end may be coupled |
| 7040930 |
Modular sockets using flexible interconnects |
May 9, 2006 |
| A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor die to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable i |
| 7019408 |
Stackable ball grid array |
March 28, 2006 |
| A stackable package to create a 3-dimensional memory array using ball grid array technology. Specifically, memory chips are coupled to a pre-formed packages which have alignment features to allow for the stacking of the ball grid arrays. The alignment features are used to align and orien |
| 7007375 |
Method for fabricating a semiconductor component |
March 7, 2006 |
| A semiconductor component includes adjustment circuitry configured to adjust selected physical and electrical characteristics of the component or elements thereof, and an input/output configuration of the component. The component includes a semiconductor die, a substrate attached to the |
| 6995043 |
Methods for fabricating routing elements for multichip modules |
February 7, 2006 |
| A routing element for use with a multichip module that includes a substrate that carries conductive traces that provide either additional electrical paths or shorter electrical paths than those provided by a multichip module substrate. The conductive traces may be carried upon a sing |
| 6987325 |
Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting e |
January 17, 2006 |
| A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerou |
| 6979596 |
Method of fabricating a tape having apertures under a lead frame for conventional IC packages |
December 27, 2005 |
| A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead fingers. The semiconductor die is |
| 6977214 |
Die paddle clamping method for wire bond enhancement |
December 20, 2005 |
| A leadframe configuration for a semiconductor device that has a die attach paddle with paddle support bars. In addition, clamp tabs extend outwardly from lesser supported locations of the paddle to underlie a conventional lead clamp. The clamp tabs are formed as an integral part of the p |
| 6958528 |
Leads under chip IC package |
October 25, 2005 |
| A semiconductor device assembly including a semiconductor device having a plurality of bond pads on the active surface thereof and a lead frame having a portion of the plurality of lead fingers of the lead frame located below the semiconductor device in a substantially horizontal plane |
| 6949821 |
Semiconductor package |
September 27, 2005 |
| A semiconductor package is provided which includes a substrate having a plurality of semiconductor dice mounted thereon. The substrate is divided into segments by grooves formed in the bottom surface of the substrate. Each semiconductor die is electrically connected to the substrate by |
