| |
 |
Jean-Free Clerc Patents |
|
Inventor: Clerc; Jean-Free
Address: Brie et Angonnes, FR
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7205211 |
Method for handling semiconductor layers in such a way as to thin same |
April 17, 2007 |
| This invention relates to a method for making a thin layer starting from a wafer comprising a front face with a given relief, and a back face, comprising steps consisting of: a) obtaining a support handle with a face acting as a bonding face; b) preparing the front face of the wafer, |
|
|
|
