| Patent Number |
Title Of Patent |
Date Issued |
| 6633079 |
Wafer level interconnection |
October 14, 2003 |
| RF MicroElectroMechanical Systems (MEMS) circuitry (15) on a first high resistivity substrate (17) is combined with circuitry (11) on a second low resistivity substrate (13) by overlapping the first high resistivity substrate (17) and MEMS circuitry (15) with the low resistivity substrat |
| 6512300 |
Water level interconnection |
January 28, 2003 |
| RF MicroElectroMechanical Systems (MEMs) circuitry(15) on a first high resistivity substrate (17)is combined with circuitry (11) onsecond low-resisitivity substrate (13) by overlapping the first high resisitivity substrate (17)and MEMs circuitry (15) with the low resisitivity substra |
| 5805426 |
Microelectronic assemblies including Z-axis conductive films |
September 8, 1998 |
| First and second electronic devices interconnected by a nonconductive nanoporous film, said film having metal-filled pores extending through the thickness of the film, such that each of said devices is contacted by the metal in at least several pores, wherein said film comprises a silico |
