| Patent Number |
Title Of Patent |
Date Issued |
| 7239337 |
Combined semiconductor apparatus with thin semiconductor films |
July 3, 2007 |
| A semiconductor apparatus includes two thin semiconductor films bonded to a substrate, and a thin-film interconnecting line electrically connecting a semiconductor device in the first thin semiconductor film to an integrated circuit in the second thin semiconductor film. The two thin |
| 7180099 |
Semiconductor apparatus with thin semiconductor film |
February 20, 2007 |
| A semiconductor apparatus includes a substrate having at least one terminal, a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed and bonded on the substrate; and an individual interconnecting line formed as a thin conducti |
| 7122834 |
Semiconductor apparatus having adhesion layer and semiconductor thin film |
October 17, 2006 |
| A semiconductor apparatus includes a substrate; an adhesion layer disposed on the substrate, the adhesion layer mainly consisting of semiconductor material; and at least one semiconductor thin film including at least one semiconductor device and bonded on the adhesion layer. The adhesion |
| 6913985 |
Method of manufacturing a semiconductor device |
July 5, 2005 |
| A peeling layer (13) and semiconductor thin film (20a) are formed on a first substrate (11), individual support materials (19) are formed thereupon, grooves (23) penetrating the semiconductor thin film and reaching the peeling layer (13) are formed in the semiconductor thin film (20a |
| 6297842 |
Organic electroluminescent light-emitting array and optical head assembly |
October 2, 2001 |
| A light-emitting array and its driving circuitry are integrated into a single device. The driving circuitry is formed in a semiconductor substrate and has an array of output terminals on a surface of the substrate. Organic electroluminescent elements are formed directly over the outp |
| 5600157 |
Light-emitting and light-sensing diode array device, and light-emitting and light-sensing diode |
February 4, 1997 |
| According to a first aspect of the invention, a light-emitting and light-sensing diode has a doped region with a depth not exceeding 2 .mu.m, for adequate sensitivity, and an impurity concentration of at least 5.times.10.sup.20 atoms/cm.sup.-3, for adequate emission. According to a s |
| 4442429 |
Display apparatus utilizing a thermally color reversible display medium which has a hysteresis e |
April 10, 1984 |
| Disclosed is an erasable display apparatus including a heat-sensitive medium 1 having a hysteresis effect relative to temperature change. This display apparatus comprises an endless broad-width heat-sensitive display medium 1, driving means 2 for rotating and transferring the heat-sensit |
| 4376282 |
Optical print head with graded index fiber arrays for optical printing devices |
March 8, 1983 |
| An optical printing device includes a photosensitive means having a photosensitive surface and an optical print head. The optical print head has a plurality of arrays of a plurality of light emitting devices selectively energized and an optical means to form light images from the lig |
| 4318597 |
Optical print head for optical printing devices |
March 9, 1982 |
| An optical printing device includes a photosensitive means having a photosensitive surface and an optical print head. The optical print head has a plurality of arrays of a plurality of light emitting devices selectively energized and an optical means to form light images from the lig |
