Boundary scan testing of devices such as printed circuit boards and multi chip modules, when the needed circuits have not been provided on IC chips by the manufacturer, is accomplished with a diagnostic and testing integrated circuit that performs a boundary scan external to available
The I/O ports of a packaged IC includes a plurality of optical conduits in the package adjacent electro-optical transmitters and receivers throughout the die spaced from the periphery of the die. The method of assembling the die in the package includes using optical transmitters on the d
The I/O ports of a packaged IC includes a plurality of optical conduits in the package adjacent electro-optical transmitters and receivers throughout the die spaced from the periphery of the die. The method of assembling the die in the package includes using optical transmitters on the d
An integrated circuit having active devices in electro-optical conversion material regions and single crystal silicon regions which are in a polycrystalline silicon support. The electro-optical conversion material regions are separated from the polycrystalline silicon by a containment
