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Hiromitsu Abe Patents
Inventor:
Abe; Hiromitsu
Address:
Kyoto, JP
No. of patents:
2
Patents:




Patent Number Title Of Patent Date Issued
6746962 Method for fabricating a semi-conductor device having a tungsten film-filled via hole June 8, 2004
A first metal film is deposited on a bottom and a wall of a recess formed in an insulating film on a semiconductor substrate. A second metal film is filled in the recess on the first metal film. The second metal film is formed from a polycrystalline tungsten film having a crystal plane o
6245588 Semiconductor light-emitting device and method of manufacturing the same June 12, 2001
A semiconductor light-emitting device includes a substrate formed of an AlGaAs-base semiconductor material. A light-emitting layer forming portion of an AlGaInP-base compound semiconductor material is formed on the substrate so as to provide a light emitting layer. On the surface of the


 
 
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