| Patent Number |
Title Of Patent |
Date Issued |
| 7306028 |
Modular heat sink |
December 11, 2007 |
| A modular based heat sink which can be easily optimized for a given heat source relies upon both phase change based heat transfer and condenser modules that combine the efficiency of folded fin cooling and the efficiency of the two phase heat transfer. |
| 7005738 |
Semiconductor package with lid heat spreader |
February 28, 2006 |
| The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device |
| 6990816 |
Hybrid capillary cooling apparatus |
January 31, 2006 |
| The apparatus is a hybrid cooler which includes one loop within which a heated evaporator forms vapor that moves to a condenser because of the vapor pressure which also drives the liquid condensate from the condenser to a liquid reservoir. A second loop is powered by a mechanical pump th |
| 6948556 |
Hybrid loop cooling of high powered devices |
September 27, 2005 |
| A heat transfer loop system includes a primary passive two-phase flow segment with an evaporator, a condenser and a liquid reservoir, and a secondary actively pumped liquid flow segment in which the liquid in the reservoir is drawn by a liquid pump into the evaporator, where a portion |
| 6889755 |
Heat pipe having a wick structure containing phase change materials |
May 10, 2005 |
| A wick for use in a heat pipe is provided incorporating particles of micro-encapsulated phase change material bonded together to form the wick. Use of a wick structure comprising micro-encapsulated PCM particles has the advantage of providing an additional heat absorber. This greatly |
| 6858929 |
Semiconductor package with lid heat spreader |
February 22, 2005 |
| The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device |
| 6631077 |
Heat spreader with oscillating flow |
October 7, 2003 |
| A heat spreader includes a plate having a first and second ends and a plurality of channels between the ends. A reservoir is located at the first end. A fluid oscillator oscillates a fluid between the first and second ends with a reciprocating flow. The oscillator is integrally conta |
| 6579747 |
Method of making electronics package with specific areas having low coefficient of thermal expan |
June 17, 2003 |
| Method of making semiconductor package including at least one semiconductor chip disposed within a housing, the housing including a lid which overlies the at least one semiconductor chip and a heat-dissipating device coupled to the housing, the heat-dissipating device including at least |
| 6566743 |
Electronics package with specific areas having low coefficient of thermal expansion |
May 20, 2003 |
| A semiconductor package including at least one semiconductor chip disposed within a housing, the housing including a lid which overlies the at least one semiconductor chip and a heat-dissipating device coupled to the housing, the heat-dissipating device including at least one area formed |
| 6536510 |
Thermal bus for cabinets housing high power electronics equipment |
March 25, 2003 |
| A thermal bus is provided for cabinets housing high power electronics equipment that includes two spaced-apart horizontally oriented parallel evaporators interconnected in flow communication with a condenser. Each evaporator is mounted in a support having a central recess and each having |
| 6525420 |
Semiconductor package with lid heat spreader |
February 25, 2003 |
| The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device |
| 6437437 |
Semiconductor package with internal heat spreader |
August 20, 2002 |
| A semiconductor package is provided that includes a substrate having a top surface, a cover, and at least one semiconductor device attached to the top surface of the substrate. The cover is secured to the substrate so as to create a space between the interior surface and the substrate su |
| 6408941 |
Folded fin plate heat-exchanger |
June 25, 2002 |
| A heat-exchanger is provided that comprises a fin core formed from a continuous sheet of thermally conductive material that has been folded into alternating flat ridges and troughs defining spaced fin walls having peripheral end edges wherein each of the fin walls has a thickness of |
| 6388882 |
Integrated thermal architecture for thermal management of high power electronics |
May 14, 2002 |
| The present invention provides a thermal energy management architecture for a functioning system of electronic components and subsystems comprising a hierarchical scheme in which thermal management components are: (i) operatively engaged with individual portions of the system of electron |
