| Patent Number |
Title Of Patent |
Date Issued |
| 7612459 |
Multi-chip module and single-chip module for chips and proximity connectors |
November 3, 2009 |
| A single-chip module is described. The module includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors coupled to the first |
| 7554195 |
Engine with cable direct to outboard memory |
June 30, 2009 |
| A device includes a first semiconductor die having a first surface and a second surface, a cable coupled to the first semiconductor die, and at least one memory device coupled to the cable. The first semiconductor die is configured to communicate by capacitive coupling using one or more |
| 7397136 |
Multi-chip module and single-chip module for chips and proximity connectors |
July 8, 2008 |
| A single-chip module is described. The module includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors coupled to the first |
| 7332919 |
Method and apparatus for distributing signals over jig-plates |
February 19, 2008 |
| One embodiment of the present invention provides a system for distributing signals through a jig-plate in a computer system. The jig-plate contains alignment features that assist in positioning semiconductor chips in relation to the jig-plate. In addition, the jig-plate contains one or |
