| Patent Number |
Title Of Patent |
Date Issued |
| 7564066 |
Multi-chip assembly with optically coupled die |
July 21, 2009 |
| Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the substrates. At least one die on one of the substrates is in optical communication with at least |
| 7554203 |
Electronic assembly with stacked IC's using two or more different connection technologies and me |
June 30, 2009 |
| An integrated circuit ("IC") package having two or more dice stacked on a substrate and electrically coupled using two or more different connection technologies may improve high-speed input/output ("I/O") bandwidth. In an embodiment, one die is a processor and at least one other die is a |
| 7432592 |
Integrated micro-channels for 3D through silicon architectures |
October 7, 2008 |
| Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures. |
| 7348678 |
Integrated circuit package to provide high-bandwidth communication among multiple dice |
March 25, 2008 |
| A system may include a microprocessor die, an integrated circuit package substrate, and a die disposed between the microprocessor die and the integrated circuit package substrate. In some embodiments, the integrated circuit package substrate defines a first cavity, and the die is dispose |
