| Patent Number |
Title Of Patent |
Date Issued |
| 8232145 |
Methods of promoting adhesion between transfer molded IC packages and injection molded plastics |
July 31, 2012 |
| A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trench |
| 8217522 |
Printed circuit board with coextensive electrical connectors and contact pad areas |
July 10, 2012 |
| A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads. |
| 8129272 |
Hidden plating traces |
March 6, 2012 |
| A strengthened semiconductor die substrate and package are disclosed. The substrate may include contact fingers formed with nonlinear edges. Providing a nonlinear contour to the contact finger edges reduces the mechanical stress exerted on the semiconductor die which would otherwise |
| 8110439 |
Method of stacking and interconnecting semiconductor packages via electrical connectors extendin |
February 7, 2012 |
| An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked semiconductor packages. A second such embodiment includes an external connector for electrically |
| 8053880 |
Stacked, interconnected semiconductor package |
November 8, 2011 |
| An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked semiconductor packages. A second such embodiment includes an external connector for electrically |
| 8053276 |
Method of stacking and interconnecting semiconductor packages via electrical connectors extendin |
November 8, 2011 |
| An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked semiconductor packages. A second such embodiment includes an external connector for electrically |
| 7939944 |
Semiconductor die having a redistribution layer |
May 10, 2011 |
| A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape a |
