Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Yu; Cheeman
Address:
Madison, WI
No. of patents:
7
Patents:












Patent Number Title Of Patent Date Issued
8232145 Methods of promoting adhesion between transfer molded IC packages and injection molded plastics July 31, 2012
A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trench
8217522 Printed circuit board with coextensive electrical connectors and contact pad areas July 10, 2012
A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads.
8129272 Hidden plating traces March 6, 2012
A strengthened semiconductor die substrate and package are disclosed. The substrate may include contact fingers formed with nonlinear edges. Providing a nonlinear contour to the contact finger edges reduces the mechanical stress exerted on the semiconductor die which would otherwise
8110439 Method of stacking and interconnecting semiconductor packages via electrical connectors extendin February 7, 2012
An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked semiconductor packages. A second such embodiment includes an external connector for electrically
8053880 Stacked, interconnected semiconductor package November 8, 2011
An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked semiconductor packages. A second such embodiment includes an external connector for electrically
8053276 Method of stacking and interconnecting semiconductor packages via electrical connectors extendin November 8, 2011
An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked semiconductor packages. A second such embodiment includes an external connector for electrically
7939944 Semiconductor die having a redistribution layer May 10, 2011
A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape a










 
 
  Recently Added Patents
System and method for providing interactive mobile content using multiple communication paths
Blends of micronized polyphenylene ether and thermoplastic polyurethanes blend
System and method for determining instantaneous deflection of a structure
Upstream channel bonding using legacy maps in a cable communications system
Organic light emitting display device and driving method thereof
Selective seed layer treatment for feature plating
Method and system for integrating global navigation satellite system (GNSS), wireless local area network (WLAN), and cell phone technology
  Randomly Featured Patents
Hard translucent high moisture soap bar
Magnetic recording/reproducing apparatus and magnetic recording/reproducing method
Methods for in-situ removal of an anti-reflective coating during an oxide resistor protect etching process
Lamp
Apparatus for positioning tyred wheels on a tyre changer machine
Polyester blow-molded articles
Lipid pathway modification in oil-bearing microorganisms
Protruding ladder steps for model railway boxcars
Apparatus for a solar water heater
Grounding strap