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Inventor: Yoshizaki; Tsutomu
Address: Yokosuka, JP
No. of patents: 3
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 4717346 |
IC socket |
January 5, 1988 |
| An integrated circuit (IC) socket comprising: a socket body of molded resin having a plurality of recesses for receiving a leadless chip carrier (LCC) type of IC device; and a cover which commonly covers the plurality of recesses for receiving an LCC type of IC device and presses said LC |
| 4616895 |
Integrated circuit socket |
October 14, 1986 |
| An integrated circuit (IC) socket comprising: a box-shaped housing of dielectric material open at the upper side thereof and having a recess for receiving a leadless chip carrier type of IC device; a plurality of contacts for contacting the electrodes of the IC device within the recess, |
| 4468616 |
Testing equipment for electric components |
August 28, 1984 |
| Testing equipment for electric components comprises: a high-temperature section including a homoiothermic chamber in which a plurality of components to be tested are heated, and a first printed board on which the components to be tested are mounted; a low-temperature section including a |
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