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Yokoyama; Takashi
Osaka, JP
No. of patents:

Patent Number Title Of Patent Date Issued
6284661 Method and apparatus for producing a wafer September 4, 2001
A method and an apparatus for cutting a wafer from a crystalline ingot, by directing a stream or streams of etching gas at the crystalline ingot in a vacuum. Waste in cutting can be greatly minimized and the work environment can also be kept clean. Further, excellent surface smoothness c
5912186 Method for processing semiconductor material June 15, 1999
A method for processing semiconductor materials such as a crystalline ingot or a wafer and an apparatus employed therein. An etching gas is supplied on the surface of a semiconductor material, while laser irradiation or light quantum irradiation is applied on a predetermined part of the
5370836 Process of making porous fluoroplastics membrane for an air depolarized battery December 6, 1994
There is provided a method of making uniform porous fluoroplastic membranes having a high Gurley number and a narrow permeability range, this method comprising closing the pores on part of the surface of a fluoroplastic film by compression or by application of an ink. Also provided is a
5242763 Battery pack and its packaging method September 7, 1993
This invention relates to a battery pack composed of a plurality of flat type gas depolarizable galvanic cells such as the zinc-air battery system and its packaging method for such battery pack. More specifically, projections of a certain value of height are formed on at least one of the

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