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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Yen; Ting
Address:
Fremont, CA
No. of patents:
1
Patents:




Patent Number Title Of Patent Date Issued
5861676 Method of forming robust interconnect and contact structures in a semiconductor and/or integrate January 19, 1999
A conducting trench in a dielectric layer can function as both (a) a plurality of contacts and (b) an interconnect in a semiconductor device. The conducting trench may be made by depositing a conductor in a trough formed in a dielectric layer of the device.


 
 
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