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Inventor: Yamakawa; Koji
Address: State College, PA
No. of patents: 3
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 5969413 |
Semiconductor device having a tab chip on a tape carrier with lead wirings provided on the tape |
October 19, 1999 |
| A semiconductor chip is supported on a tape carrier provided with lead wirings. The semiconductor chip is electrically connected to the lead wirings. The semiconductor chip of this quality is bonded in combination with the pe carrier to an aluminum nitride substrate. The lead wirings |
| 5907187 |
Electronic component and electronic component connecting structure |
May 25, 1999 |
| In such electronic components as semiconductor packages and semiconductor chips which are possessed of groups of connecting bumps as input and output terminals, the groups of connecting bumps comprise not less than two kinds of connecting bumps different in melting point or not less than |
| 5714801 |
Semiconductor package |
February 3, 1998 |
| A semiconductor package is disclosed which is provided with a multilayer ceramic substrate such as, for example, a multilayer aluminum nitride substrate having a surface for mounting a semiconductor device and, at the same time, having an inner wiring layer electrically connected to the |
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